Jim C Pierce

US Patent:

20110006409, Jan 13, 2011

Filed:

Jul 13, 2009

Appl. No.:

12/501849

Inventors:

Michael D. Gruenhagen - Salt Lake City UT, US
James J. Murphy - South Jordan UT, US
Suku Kim - South Jordan UT, US
Jim Pierce - Sandy UT, US
William S. Beggs - Salt Lake City UT, US
Robert J. Purtell - West Jordan UT, US

International Classification:

H01L 23/498
H01L 23/495

US Classification:

257666, 257754, 257737, 257E23031, 257E23072

Abstract:

Semiconductor devices containing nickel-titanium (NiTi or TiNi) compounds (or alloys) and methods for making such devices are described. The devices contain a silicon substrate with an integrated circuit having a drain on the backside of the substrate, a TiNi contact layer contacting the drain on the backside of the substrate, a soldering layer on the contact layer, an oxidation reducing layer on the soldering layer, a solder bump on the soldering layer, and a lead frame attached to the solder bump. The combination of the Ti and Ni materials in the contact layer exhibits many features not found in the Ti and Ni materials alone, such as reduced backside on-resistance, ability to form a silicide with the Si substrate at lower temperatures, reduced wafer warpage, increased ductility for improved elasticity, and good adhesion properties. Other embodiments are described.

US Patent:

20110031596, Feb 10, 2011

Filed:

Aug 5, 2009

Appl. No.:

12/535963

Inventors:

Mike D. Gruenhagen - Salt Lake City UT, US
James J. Murphy - South Jordan UT, US
Suku Kim - South Jordan, KR
Jim Pierce - Sandy UT, US
William S. Beggs - Salt Lake City UT, US
Thomas P. Welch - South Jordan UT, US

International Classification:

H01L 23/495
H01L 23/498
H01L 23/488
B23K 35/22

US Classification:

257666, 257737, 257690, 428576, 257E23031, 257E23068, 257E23023

Abstract:

Semiconductor devices containing nickel-titanium (NiTi or TiNi) compounds or alloys and methods for making such devices are described. The devices contain a silicon substrate with an integrated circuit, a contact layer contacting the substrate, a TiNi-containing soldering layer on the contact layer, an oxidation prevention layer on the soldering layer, a solder bump on the soldering layer, and a lead frame or PCB attached to the solder bump. The combination of the Ti and Ni materials in the soldering layer exhibits many features not found in the Ti and Ni materials alone, such as reduced wafer warpage, increased ductility for improved elasticity, decreased consumption of the Ni in the soldering layer, and decreased manufacturing costs. Other embodiments are described.

US Patent:

20230046399, Feb 16, 2023

Filed:

Oct 26, 2022

Appl. No.:

17/974318

Inventors:

- Orem UT, US
Michael Black - Orem UT, US
R. Stewart Nielson - Pleasant Grove UT, US
Bradley R. Williams - Pocatello ID, US
Benjamin Downard - Draper UT, US
Jeffrey H. Rice - South Jordan UT, US
JIm Pierce - Sandy UT, US

International Classification:

G02B 5/30

Abstract:

A reflective wire grid polarizer (WGP) can include an array of wires on a face of a substrate with channels between adjacent wires The wires can have certain characteristics for WGP performance, such as index of refraction, alternating high/low index continuous thin films, thickness of layer(s), duty cycle, reflective rib shape, a curved side of transparent ribs or aspect ratio, or combinations thereof.

US Patent:

20210018669, Jan 21, 2021

Filed:

Jul 2, 2020

Appl. No.:

16/919513

Inventors:

- Orem UT, US
Michael Black - Oram UT, US
R. Stewart Nielson - Pleasant Grove UT, US
Bradley R. Williams - Pocatello ID, US
Benjamin Downard - Draper UT, US
Jeffrey H. Rice - South Jordan UT, US
Jim Pierce - Sandy UT, US

International Classification:

G02B 5/30

Abstract:

A reflective wire grid polarizer (WGP) can include an array of wires on a face of a substrate , with channels between adjacent wires . The wires can have certain characteristics for WGP performance, such as index of refraction, alternating high/low index continuous thin films, thickness of layer(s), duty cycle, reflective rib shape, a curved side of transparent ribs or , aspect ratio, or combinations thereof.