Tai An Ly - Fremont CA Jean-Charles Giomi - Menlo Park CA Kalyana C. Mulam - San Jose CA Paul Andrew Wilcox - Palo Alto CA David Lansing Dill - Redwood City CA Paul Estrada, II - Los Altos CA Jing Chyuarn Lin - Sunnyvale CA Robert Kristianto Mardjuki - Danville CA Ping Fai Yeung - San Jose CA
Assignee:
O-In Design Automation, Inc. - San Jose CA
International Classification:
G06F 1750
US Classification:
716 4, 703 14, 703 17
Abstract:
A programmed computer generates descriptions of circuits (called âcheckersâ) that flag functional defects in a description of a circuit undergoing functional verification. The programmed computer automatically converts the circuits description into a graph, automatically examines the graph for instances of a predetermined arrangement of nodes and connections, and automatically generates instructions that flag a behavior of a device represented by the instance in conformance with a known defective behavior. The checkers can be used during simulation or emulation of the circuit, or during operation of the circuit in a semiconductor die The circuits description can be in Verilog or VHDL and the automatically generated checkers can also be described in Verilog or VHDL. Therefore, the checkers can co-simulate with the circuit, monitoring the simulated operation of the circuit and flagging detective behavior. The programmed computer can automatically determine load conditions of registers in the circuit and automatically generate checkers to flag data loss in the registers.
Method For Automatically Generating Checkers For Finding Functional Defects In A Description Of Circuit
Tai An Ly - Fremont CA, US Jean-Charles Giomi - Menlo Park CA, US Kalyana C. Mulam - San Jose CA, US Paul Andrew Wilcox - Palo Alto CA, US David Lansing Dill - Redwood City CA, US Paul II Estrada - Los Alto CA, US Jing Chyuarn Lin - Sunnyvale CA, US Robert Kristianto Mardjuki - Danville CA, US Ping Fai Yeung - San Jose CA, US
International Classification:
G06F 17/50
US Classification:
716 4, 716 5, 703 13, 703 20, 703 23, 703 28
Abstract:
A programmed computer generates descriptions of circuits (called “checkers”) that flag functional defects in a description of a circuit undergoing functional verification. The programmed computer automatically converts the circuit's description into a graph, automatically examines the graph for instances of a predetermined arrangement of nodes and connections, and automatically generates instructions that flag a behavior of a device represented by the instance in conformance with a known defective behavior. The checkers can be used during simulation or emulation of the circuit, or during operation of the circuit in a semiconductor die. The circuit's description can be in Verilog or VHDL and the automatically generated checkers can also be described in Verilog or VHDL. Therefore, the checkers can co-simulate with the circuit, monitoring the simulated operation of the circuit and flagging defective behavior. The programmed computer can automatically determine load conditions of registers in the circuit and automatically generate checkers to flag data loss in the registers.
Kayhan Kucukcakar - Sunnyvale CA, US Jing C. Lin - Cupertino CA, US Jinan Lou - Cupertino CA, US
Assignee:
Synopsys, Inc. - Mountain View CA
International Classification:
G06F 17/50
US Classification:
716 5, 716 6, 703 16
Abstract:
A method for reaching signoff closure in an ECO (engineering change order) process involves the use of violation context data from the signoff tool as the basis for design layout modifications in an implementation tool. The violation context data includes violation information other than violation location/path information. Because the signoff tool, and more specifically, the signoff algorithm used by that tool is the most accurate model of actual IC behavior, the use of violation context data generated by the signoff tool to implement changes to the design layout will generally produce appropriate and effective results. By accessing this violation context data from the signoff tool, an implementation tool need not rely on its less accurate implementation analysis to determine the optimal design layout modifications for correcting violations detected by the signoff tool.
Avgerinos V. Gelatos - Redwood City CA, US Kai Wu - Palo Alto CA, US Amit Khandelwal - Santa Clara CA, US Ross Marshall - Sunnyvale CA, US Emily Renuart - Santa Clara CA, US Wing-Cheong Gilbert Lai - Santa Clara CA, US Jing Lin - Mountain View CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 21/4763
US Classification:
438649, 438683, 427255392, 257E21165
Abstract:
Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes to provide tungsten films having significantly improved surface uniformity while increasing the production level throughput. In one embodiment, a method is provided which includes depositing a tungsten silicide layer on the substrate by exposing the substrate to a continuous flow of a silicon precursor while also exposing the substrate to intermittent pulses of a tungsten precursor. The method further provides that the substrate is exposed to the silicon and tungsten precursors which have a silicon/tungsten precursor flow rate ratio of greater than 1, for example, about 2, about 3, or greater. Subsequently, the method provides depositing a tungsten nitride layer on the tungsten suicide layer, depositing a tungsten nucleation layer on the tungsten nitride layer, and depositing a tungsten bulk layer on the tungsten nucleation layer.
Pre-Route And Post-Route Net Correlation With Defined Patterns
Chi-Min Chu - Cupertino CA, US Jing C. Lin - Cupertino CA, US
Assignee:
Synopsys, Inc. - Mountain View CA
International Classification:
G06F 17/50
US Classification:
716132
Abstract:
A method of improving pre-route and post-route correlation can include performing an initial placement, virtual routing, and lower-effort actual routing for the design. The results of the virtual routing and lower-effort actual routing can be compared to identify nets having miscorrelation. Based on the nets having at least a predetermined miscorrelation, one or more patterns can be defined. At this point, net routing constraints and/or scaling factors can be assigned to nets matching the defined patterns. These net routing constraints and scaling factors can be applied to the nets of the design that match the patterns. Optimized placement and a higher-effort actual routing of the design can be performed using the nets with the applied net routing constraints and scaling factors. An optimized, routed design can be generated as output.
System And User Interface For Machine-Assisted Human Labeling Of Pixels In An Image
Eric Saund - San Carlos CA, US Jing Lin - Saratoga CA, US Prateek Sarkar - Sunnyvale CA, US
Assignee:
Palo Alto Research Center Incorporated - Palo Alto CA
International Classification:
G06K 9/34
US Classification:
382164, 715810
Abstract:
A user interface and method is embodied on a computer readable medium and executable on a computer. The user interface is a labeler which labels only foreground pixels of an image stored in a computing environment. The labeler operates in a Region mode/state and Brush mode/state, and includes a Tentative mode that permits an assigned label to be changed after pixels have been selected. Groups of pixels may be selected for labeling at once by a point-and-click command, and a pixel may belong to one or more groups of pixels which are stored in memory as image layers. The groups are formed dynamically by user selection actions, and/or through automatic recognition algorithms. Pixels already labeled with certain labels may be locked to not be altered by additional labeling operations. Unassigned pixels may be highlighted to increase the ease at which they are identified in an image. Comparisons between labeled images are undertaken to indicate differences between different groundtruth labeling.
Temperature Controlled Lid Assembly For Tungsten Nitride Deposition
Avgerinos V. Gelatos - Redwood City CA, US Xiaoxiong Yuan - San Jose CA, US Salvador P. Umotoy - Antioch CA, US Yu Chang - San Jose CA, US Emily Renuart - Santa Clara CA, US Jing Lin - Mountain View CA, US Wing-Cheong Lai - Santa Clara CA, US Sang Q. Le - San Jose CA, US
International Classification:
C23C 16/06
US Classification:
118724
Abstract:
Embodiments of the invention provide apparatuses for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a processing chamber is provided which includes a lid assembly containing a lid plate, a showerhead, a mixing cavity, a distribution cavity, and a resistive heating element contained within the lid plate. In one example, the resistive heating element is configured to provide the lid plate at a temperature within a range from about 120 C. to about 180 C., preferably, from about 140 C. to about 160 C., more preferably, from about 145 C. to about 155 C. The mixing cavity may be in fluid communication with a tungsten precursor source containing tungsten hexafluoride and a nitrogen precursor source containing ammonia. In some embodiments, a single processing chamber may be used to deposit metallic tungsten and tungsten nitride materials by CVD processes.
Process For Tungsten Nitride Deposition By A Temperature Controlled Lid Assembly
Avgerinos V. Gelatos - Redwood City CA, US Xiaoxiong Yuan - San Jose CA, US Salvador P. Umotoy - Antioch CA, US Yu Chang - San Jose CA, US Emily Renuart - Santa Clara CA, US Jing Lin - Mountain View CA, US Wing-Cheong Lai - Santa Clara CA, US Sang Q. Le - San Jose CA, US
International Classification:
H01L 21/44
US Classification:
438654, 257E21476
Abstract:
Embodiments of the invention provide processes for vapor depositing tungsten-containing materials, such as metallic tungsten and tungsten nitride. In one embodiment, a method for forming a tungsten-containing material is provided which includes positioning a substrate within a processing chamber containing a lid plate, heating the lid plate to a temperature within a range from about 120 C. to about 180 C., exposing the substrate to a reducing gas during a pre-nucleation soak process, and depositing a first tungsten nucleation layer on the substrate during a first atomic layer deposition process within the processing chamber. The method further provides depositing a tungsten nitride layer on the first tungsten nucleation layer during a vapor deposition process, depositing a second tungsten nucleation layer on the tungsten nitride layer during a second atomic layer deposition process within the processing chamber, and exposing the substrate to another reducing gas during a post-nucleation soak process.
Newborn Medicine AssociatesMount Sinai Hospital Newborn Medicine 1184 5 Ave STE 341, New York, NY 10029 2122415446 (phone), 2125345207 (fax)
Education:
Medical School Wenzhou Med Coll, Wenzhou, Zhejiang, China Graduated: 1983
Languages:
English Spanish
Description:
Dr. Lin graduated from the Wenzhou Med Coll, Wenzhou, Zhejiang, China in 1983. He works in New York, NY and specializes in Neonatal-Perinatal Medicine. Dr. Lin is affiliated with Mount Sinai Medical Center.