A method and system for providing a spin valve for use in a magnetoresistive head is disclosed. The method and system include providing a synthetic pinned layer, a nonmagnetic spacer layer, and a free layer. The free layer has a first magnetization canted from a first direction by a first angle. The nonmagnetic spacer layer is disposed between the free layer and the synthetic pinned layer. The synthetic pinned layer has a second magnetization in a second direction. The second direction is canted from a third direction that is transverse to the first direction by a second angle. The second magnetization is substantially orthogonal to the first magnetization.
Magnetoresistive Sensor With Overlapping Lead Layers Including Alpha Tantalum And Conductive Layers
Jinqiu Zhang - Fremont CA, US Jing Zhang - San Jose CA, US Yiming Huai - Pleasanton CA, US Lifan Chen - Fremont CA, US
Assignee:
Western Digital (Fremont), Inc. - Fremont CA
International Classification:
G11B005/39
US Classification:
360322
Abstract:
Magnetoresistive (MR) sensors are disclosed that have leads that overlap a MR structure and distribute current to and from the MR structure so that the current is not concentrated in small portions of the leads, alleviating the problems mentioned above. For example, the leads can be formed of a body-centered cubic (bcc) form of tantalum, combined with gold or other highly conductive materials. For the situation in which a thicker bcc tantalum layer covers a highly conductive gold layer, the tantalum layer protects the gold layer during MR structure etching, so that the leads can have broad layers of electrically conductive material for connection to MR structures. The broad leads also conduct heat better than the read gap material that they replace, further reducing the temperature at the connection between the leads and the MR structure.
Magnetic Recording Head With A Side Shield Structure For Controlling Side Reading Of Thin Film Read Sensor
Thomas Young Chang - Menlo Park CA, US Yingjian Chen - Fremont CA, US Jing Zhang - San Jose CA, US Heng Gong - Layton UT, US
Assignee:
Western Digital (Fremont), Inc. - Lake Forest CA
International Classification:
G11B005/39
US Classification:
360319
Abstract:
Side shield structures magnetically shielding a read sensor to block side reading of tracks on a magnetic media. The read heads include bottom and top magnetic shield layers, a read sensor or magnetically sensitive element between the bottom and top magnetic shield layers, and a side shield assembly formed of magnetically shielding material positioned between the bottom and top magnetic shield layers and adjacent at least a portion of the read sensor. In current-in-plane embodiments, the side shield assembly includes a pair of side shields of magnetically shielding material adjacent a lower portion of the read sensor formed on a lower read gap. In current-perpendicular-to-plane embodiments, the side shield assembly includes a pair of side shields extending from the bottom magnetic shield adjacent lower sides of the read sensor and/or a pair of side shields extending from the top magnetic shield adjacent upper sides of the read sensor.
Magnetoresistive Sensor With Overlapping Leads Having Distributed Current
Kroum Stoev - Fremont CA, US Mathew Gibbons - Livermore CA, US Francis Liu - Fremont CA, US Bogdan M. Simion - Pleasanton CA, US Aparna C. Vadde - Fremont CA, US Jing Zhang - San Jose CA, US Yiming Huai - Pleasanton CA, US Marcos M. Lederman - San Francisco CA, US
Assignee:
Western Digital (Fremont), Inc. - Fremont CA
International Classification:
G11B 5/39
US Classification:
360322
Abstract:
Magnetoresistive (MR) sensors have leads that overlap a MR structure and distribute current to the MR structure so that the current is not concentrated in small portions of the leads. An electrically resistive capping layer can be formed between the leads and the MR structure to distribute the current. The leads can include resistive layers and conductive layers, the resistive layers having a thickness-to-resistivity ratio that is greater than that of each of the conductive layers. The resistive layers may protect the conductive layers during MR structure etching, so that the leads have broad layers of electrically conductive material for connection to MR structures. The broad leads conduct heat better than the read gap material that they replace, further reducing the temperature at the connection between the leads and the MR structure.
Method Of Weighted Combination Specs For Enhanced Manufacturing Yield
Embodiments of the invention provide methods for enhancing the downstream product yield without significantly affecting the yield of components from which downstream products are made or enhancing yield of the components without significantly affecting the downstream product yield and performance. In one embodiment, a method comprises obtaining a failure rate of the downstream manufacturing process as a function of each of a plurality of component performance parameters of the current manufacturing process of the component; optimizing weighted factors based on correlation between the current manufacturing process of the component and the downstream product, the weight factors each corresponding to one of the plurality of component performance parameters; and calculating figure of merits (FOM) with respect to the plurality of component performance parameters of the current manufacturing process of the component, the FOM including the weighted factors.
Method For Forming A Hard Bias Structure In A Magnetoresistive Sensor
A method for forming a hard bias structure in a magnetoresistive sensor is disclosed. A magnetoresistive sensor having a soft magnetic bias layer, spacer layer, and a magnetoresistive layer, is formed over a substrate having a gap layer. A mask is formed over a portion of the magnetoresistive sensor structure to define a central region. The masked structure is ion milled to remove portions not shielded by the mask, to form the central region with sloped sides, and to expose a region of the gap layer laterally adjacent the sloped sides. A first underlayer is deposited onto at least the sloped sides at a high deposition angle. A second underlayer is deposited to at least partially overlap the first underlayer, and at a first lower deposition angle. A hard bias layer is deposited over at least a portion of the second underlayer, and at a second lower deposition angle.
System And Method For Determining Head-Disk Contact In A Magnetic Recording Disk Drive By Magnetoresistive Signal Amplitude
Yong Shen - Saratoga CA, US Jing Zhang - San Jose CA, US
Assignee:
Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam
International Classification:
G11B 15/18
US Classification:
360 69
Abstract:
A system and method for determining head-disk contact (HDC) in a disk drive uses the signal from the magnetoresistive (MR) read head and does not require the presence of magnetic transitions on the disk. The method thus has application in head-disk testers or “spin stands” to facilitate the design and testing of slider-suspension assemblies and fly-height actuators, as well as in disk drives to take corrective action before HDC and/or to control fly-height actuators. The invention is also a magnetic recording disk drive that has a fly-height actuator and a low-pass filter and comparator circuit for the MR signal. When the output of the filter exceeds a threshold the comparator circuit output indicates the onset of HDC. The comparator circuit output is input to a digital processor or controller. When the controller determines the onset of HDC or that HDC has occurred, it generates a control signal that can be used to cause the disk drive to take corrective action.
System And Method For Measuring Readback Signal Amplitude Asymmetry In A Perpendicular Magnetic Recording Disk Drive
Mike X. Wang - San Jose CA, US Jing Zhang - San Jose CA, US
Assignee:
Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam
International Classification:
G11B 5/09
US Classification:
360 46, 360 31
Abstract:
A method for operating a tester for testing heads and disks of a magnetic recording disk drive during manufacturing calculates the readback signal amplitude asymmetry in the frequency domain without the need for measurement in the time domain with a peak detection channel. The tester first signals the write head to write a first pattern on the disk to generate a readback signal with positive pulses. The read head then detects this first recorded pattern and sends the readback signal to a spectrum analyzer connected to the tester. The tester then signals the write head to write a second pattern on the disk to generate a readback signal with negative pulses. The read head then detects this second recorded pattern and sends the readback signal to the spectrum analyzer. The spectrum analyzer measures the amplitudes of the first and second readback signals in the frequency domain using a bandpass filter. A controller in the tester calculates readback signal amplitude asymmetry from the measured amplitudes of the first and second readback signals.
Isbn (Books And Publications)
Ren Min Bi Jun Heng Hui Lu Yu Zhongguo Wai Mao: Equilibrium Exchange Rate of RMB and the Foreign Trade of China
Embry-Riddle Aeronautical University Shenyang, CN 2010 to Dec 2010 InterpreterShenyang Normal University Shenyang, CN Nov 2010 to Nov 2010 InterpreterInternational Raspberry Festival Shenyang, CN Jul 2010 to Jul 2010 InterpreterChinese Challenge Cup in Liaoning Shenyang, CN 2008 to 2008 Excellent Representative
Education:
American University Washington College of Law Washington, DC May 2013 LL.M in International Legal Study Program
Oct 2014 to 2000 UnderwriterTaiping Life Insurance Co., LTD Chengdu, CN Sep 2012 to Jan 2013 InternPing'An Insurance Chengdu, CN Jul 2010 to Aug 2010 Intern
Education:
Johns Hopkins Carey Business School Washington, DC 2013 to 2014 Master of Science in FinanceOne of the five candidates representing Johns Hopkins Carey Business School 2013 to 2014 CFA Institute Research Challenge 2014Southwestern University of Finance and Economics Chengdu, CN 2009 to 2013 Bachelor of Economics in Insurance and Actuarial ScienceIntensive Internship program Harrisburg, PA 2012 to 2012 Summer Work and Travel Program
Skills:
Advanced Excel, Word, PowerPoint, Eviews, Morningstar Direct
Nov 2013 to 2000 Statistical ModelerRandstad Charlotte, NC Feb 2013 to Jul 2013 Data Analyst/ScientistTMC Charlotte, NC Jul 2011 to Dec 2012 Data AnalystInternet Marketer and Asset Management
Nov 2005 to Jun 2011 Internet Market and Asset ManagementPrimerica Financial Fremont, CA Mar 2003 to Dec 2005 Personal Financial & Investment AdvisorProvidian Financial/Washington Mutual Bank San Francisco, CA Feb 1998 to Nov 2005 Statistical ModelerWells Fargo San Francisco, CA Dec 1997 to Mar 1998 Trilogy SAS Programmer ConsultantHousehold International Salinas, CA Sep 1997 to Dec 1997 SAS ProgrammerWells Fargo Des Moines, IA Oct 1996 to Sep 1997 Statistical Modeler
Education:
Iowa State University Ames, IA May 1997 M. S. in Statistics
Sep 2013 to 2000 MECHATRONICS PROJECTKLA-Tencor Corporation
Jun 2013 to Aug 2013 MECHANICAL ENGINEERING INTERNMechanical Engineering Department, Purdue University
Jan 2012 to May 2013 RESEARCH ASSISTANTMechanical Engineering department, Purdue University West Lafayette, IN Aug 2011 to May 2012 TUTORING
Education:
STANFORD UNIVERSITY Stanford, CA Sep 2013 Master of Engineering in Mechanical EngineeringPURDUE UNIVERSITY West Lafayette, IN Aug 2009 to May 2013 Bachelor of Engineering in Mechanical Engineering
Jun 2013 to 2000 AccountantAECOM Design and Planning (Shanghai) Ltd.
Dec 2011 to May 2012 Accounting AssistantCitibank (China) Co., Ltd
Jul 2011 to Aug 2011 Summer InternChina Everbright Bank
Jul 2010 to Aug 2010 Summer Intern
Education:
University of Maryland, College Park College Park, MD 2012 to 2013 Master of Science in AccountingShanghai University of International Business and Economics 2008 to 2012 Bachelor of Economics in FinanceDouglas College 2008 to 2012 Bachelor of Business Administration in Financial Services and Administration
Towson University Towson, MD 2012 to 2014 BA in Information TechnologyHoward Community College Columbia, MD 2010 to 2012 Computer ForensicsAtholton High School Columbia, MD 2006 to 2010 High School Diploma
Jun 2011 to May 2012 Legal AssistantEmbry-Riddle Aeronautical University Shenyang, CN 2010 to Dec 2010 InterpreterShenyang Normal University Shenyang, CN Nov 2010 to Nov 2010 InterpreterInternational Raspberry Festival Shenyang, CN Jul 2010 to Jul 2010 InterpreterChinese Challenge Cup in Liaoning Shenyang, CN 2008 to 2008 Excellent Representative
Education:
American University Washington College of Law Washington, DC May 2013 LL.M in International Legal Study Program
Petro-King Oilfield Technology Ltd Shenzhen, CN Jul 2010 to Jan 2012 Assistant to PresidentIF New Media International Ltd Shenzhen, CN Oct 2009 to Jul 2010 Assistant to General Manager & Marketing ManagerABN Amro Bank Shenzhen, CN Aug 2008 to Oct 2009 Customer Relationship ManagerArtini International Group Shenzhen, CN Sep 2006 to Jul 2008 Assistant to Executive DirectorDell (China) Inc Xiamen, CN Oct 2005 to Sep 2006 Inside Sales Account Manager
Education:
Royal Melbourne Institute of Technology 2005 B.S. in International Business
Lead author Jing Zhang, who earned a Ph.D. in cognitive sciences at UC Irvine in 2023 and is now a postdoctoral research fellow at Harvard Medical School, added, Our work provides the first empirical support for dreamings active involvement in sleep-dependent emotional memory processing, suggestin