Jingbin Feng

US Patent:

6713122, Mar 30, 2004

Filed:

Oct 15, 2002

Appl. No.:

10/272693

Inventors:

Steven T. Mayer - Lake Oswego OR
John B. Alexy - West Linn OR
Jingbin Feng - Lake Oswego OR

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

B05D 512

US Classification:

427 98, 438678, 118 58, 118603, 134 28

Abstract:

Methods and apparatus for reducing heat load and air exposure when using an electroless plating fluid during a plating process, are presented. An electroless plating apparatus, including an electroless plating vessel and recirculation systems, is presented. The electroless plating vessel minimizes air exposure (and thus evaporative cooling and degradation) of the electroless plating fluid while the recirculation systems minimize heat load of the electroless plating fluid.

US Patent:

6967174, Nov 22, 2005

Filed:

Feb 3, 2003

Appl. No.:

10/357999

Inventors:

Steven T. Mayer - Lake Oswego OR, US
Steve Taatjes - Sherwood OR, US
Andy McCutcheon - Vancouver WA, US
Jim Schall - Malalla OR, US
Jingbin Feng - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

H01L021/302

US Classification:

438748, 438745, 438754, 216 92, 216105, 134 13

Abstract:

A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for example, attached to arms of the wafer chuck. These members may assume an alignment position when a robot arm places the wafer on the chuck. In this position, they guide the wafer into a proper alignment position with respect to the chuck. During rotation at a particular rotational speed, the alignment members move away from the wafer to allow liquid etchant to flow over the entire edge region of the wafer. At still higher rotational speeds, the wafer is clamped into position to prevent it from flying off the chuck. A clamping cam or other device (such as the alignment member itself) may provide the clamping.

US Patent:

7690324, Apr 6, 2010

Filed:

Aug 9, 2005

Appl. No.:

11/200338

Inventors:

Jingbin Feng - Lake Oswego OR, US
Steven T. Mayer - Lake Oswego OR, US
Daniel Mark Dinneen - Portland OR, US
Edmund B. Minshall - Sherwood OR, US
Christopher M. Bartlett - Beaverton OR, US
Eric G. Webb - West Linn OR, US
R. Marshall Stowell - Wilsonville OR, US
Mark T. Winslow - Camas WA, US
Avishai Kepten - Lake Oswego OR, US
Norman D. Kaplan - Portland OR, US
Richard K. Lyons - Sandy OR, US
John B. Alexy - West Linn OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

B05C 11/02

US Classification:

118 52, 118731, 118429, 118423

Abstract:

During fluid treatment of a substrate surface, a carrier/wafer assembly containing a substrate wafer closes the top of a microcell container. The carrier/wafer assembly and the container walls define a thin enclosed treatment volume that is filled with treating fluid, such as electroless plating solution. The thin fluid-treatment volume typically has a volume in a range of about from 100 ml to 500 ml. Preferably a container is heated and the treating fluid is pre-heated before being injected into the container. Preferably, the chemical composition, temperature, and other properties of fluid in the thin enclosed fluid-treatment volume are dynamically variable. A rinse shield and a rinse nozzle are located above the container. A carrier/wafer assembly in a rinse position substantially closes the top of the rinse shield.

US Patent:

8172646, May 8, 2012

Filed:

Feb 27, 2009

Appl. No.:

12/394339

Inventors:

Jingbin Feng - Lake Oswego OR, US
Aaron LaBrie - Oregon City OR, US
Kousik Ganesan - Tualatin OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

B24B 1/00

US Classification:

451 41, 451367, 451397, 451385, 279106, 414941

Abstract:

Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.

US Patent:

8257781, Sep 4, 2012

Filed:

Aug 11, 2005

Appl. No.:

11/201709

Inventors:

Eric G. Webb - West Linn OR, US
Steven T. Mayer - Lake Oswego OR, US
David Mark Dinneen - Portland OR, US
Edmund B. Minshall - Sherwood OR, US
Christopher M. Bartlett - Beaverton OR, US
R. Marshall Stowell - Wilsonville OR, US
Mark T. Winslow - Camas WA, US
Avishai Kepten - Lake Oswego OR, US
Jingbin Feng - Lake Oswego OR, US
Norman D. Kaplan - Portland OR, US
Richard K. Lyons - Sandy OR, US
John B. Alexy - West Linn OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C23C 14/00

US Classification:

427 979, 427 995

Abstract:

A main reservoir holds cool reactant liquid. A reaction vessel for treating a substrate is connected to the main reservoir by a feed conduit. A heater is configured to heat reactant liquid in the feed conduit before the liquid enters the reaction vessel. Preferably, the heater is a microwave heater. A recycle conduit connects the reaction vessel with the main reservoir. Preferably, a recycle cooler cools reactant liquid in the recycle conduit before the liquid returns to the main reservoir. Preferably, an accumulation vessel is integrated in the feed conduit for accumulating, heating, conditioning and monitoring reactant liquid before it enters the reaction vessel. Preferably, a recycle accumulator vessel is integrated in the recycle conduit to accommodate reactant liquid as it empties out of the reaction vessel.

US Patent:

8262871, Sep 11, 2012

Filed:

Dec 17, 2009

Appl. No.:

12/640992

Inventors:

Steven T. Mayer - Lake Oswego OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Tualatin OR, US
Zhian He - Tigard OR, US
Jingbin Feng - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

C25B 9/00
C25D 17/00

US Classification:

204263, 204242, 205 80

Abstract:

An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

US Patent:

D668211, Oct 2, 2012

Filed:

Sep 10, 2010

Appl. No.:

29/369658

Inventors:

Jingbin Feng - Lake Oswego OR, US
Marshall Stowell - Wilsonville OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

1302

US Classification:

D13101

US Patent:

8475636, Jul 2, 2013

Filed:

Jun 9, 2009

Appl. No.:

12/481503

Inventors:

Steven Mayer - Lake Oswego OR, US
Jingbin Feng - Lake Oswego OR, US
Zhian He - Tigard OR, US
Jonathan Reid - Sherwood OR, US
Seshasayee Varadarajan - Lake Oswego OR, US

Assignee:

Novellus Systems, Inc. - Fremont CA

International Classification:

C25D 17/12
C25D 21/12

US Classification:

2042289, 2042294, 2042307, 204DIG 7, 205 96

Abstract:

An apparatus for electroplating a layer of metal onto the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer and an auxiliary cathode located between the anode and the ionically resistive ionically permeable element. The ionically resistive ionically permeable element serves to modulate ionic current at the wafer surface. The auxiliary cathode is configured to shape the current distribution from the anode. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.