John M Amato

US Patent:

56354142, Jun 3, 1997

Filed:

Mar 28, 1995

Appl. No.:

8/409762

Inventors:

Gregory Zakaluk - Seaford NY
Dennis Garbis - S. Huntington NY
Willem Einthoven - Belle Mead NJ
Joseph Chan - Kings Park NY
Jack Eng - Bellmore NY
Jun Wu - Coram NY
John Amato - Northport NY

International Classification:

H01L 21265

US Classification:

438471

Abstract:

Significant reduction in the cost of fabrication of shallow junction, Schottky or similar semiconductor devices without sacrifice of functional characteristics, while at the same time achieving the advantages is achieved, after the non-polishing cleaning step is essentially performed, by subjecting the substrate to conditions which move disadvantageous factors within said substrate into a space substantially at said surface, followed by substantially removing said factor-containing space from said substrate chemical removal step, followed etching and vapor deposition steps. Although these new steps add time, and therefore cost, to the overall process, the devices under discussion when produced by known industry processes require yet more time, and involve yet more expense, so that the total process represents a substantial reduction in the cost of their manufacture while producing devices which are the equivalent or superior in electrical performance to such devices which are made by known industry processes.

US Patent:

40252671, May 24, 1977

Filed:

Nov 4, 1975

Appl. No.:

5/628798

Inventors:

John Amato - Plandome NY
Charles Hirsch - New York NY
Louis Siegel - Monroe NY

International Classification:

B29C 700

US Classification:

425236

Abstract:

A continuous molding machine particularly adapted for but not limited, in principle, to the making of waffles includes a lower conveyor carrying a plurality of forms each constituting a first part of a respective two-part split mold, a second conveyor carrying a plurality of forms each constituting the other part of the respective split molds and means for guiding the respective conveyors in respective paths so that the first and second mold parts are carried from spaced apart positions to positions in which the parts meet in registry and each of the molds defined by the parts is thereby closed and then the first and second mold parts are carried away from each other again so that each of the molds is opened. The conveyors carrying the mold parts may be passed through an oven to different extents so that the respective conveyors are heated differently and means are provided for aligning the mating mold parts despite different thermal expansions of the conveyors. Means may be provided for facilitating or positively effecting partial opening of the closed molds to permit the release of gases or vapors contained in the molds.

US Patent:

56400438, Jun 17, 1997

Filed:

Dec 20, 1995

Appl. No.:

8/580071

Inventors:

Jack Eng - Cork City, IE
Joseph Chan - Kings Park NY
Lawrence Laterza - Miller Place NY
Gregory Zakaluk - Seaford NY
Jun Wu - Flushing NY
John Amato - Northport NY
Dennis Garbis - Huntington Station NY
Willem Einthoven - Belle Mead NJ

Assignee:

General Instrument Corporation of Delaware - Hatboro PA

International Classification:

H01L 2906
H01L 27082

US Classification:

257624

Abstract:

A high voltage silicon rectifier includes a substrate portion and an epitaxial mesa portion that is a frustrum of a pyramid with a substantially square cross section and side walls that make a forty five degree angle with the substrate portion. The mesa portion includes three germanium doped layers that introduce strain to speed up recombination of charge carriers. The topography of the base region of the rectifier has a high-low junction that includes a central portion that is deeper in the mesa than the germanium-doped layers and an edge portion that is shallower in the mesa than the germanium-doped layers and forms a positive bevel angle with the tapered side walls of the mesa,.

US Patent:

62486519, Jun 19, 2001

Filed:

Jun 24, 1998

Appl. No.:

9/103731

Inventors:

Jack Eng - Bellmore NY
Joseph Chan - Kings Park NY
Gregory Zakaluk - N. Seaford NY
John Amato - Northport NY
Dennis Garbis - South Huntington NY

Assignee:

General Semiconductor, Inc. - Melville NY

International Classification:

H01L 21225
H01L 21302

US Classification:

438558

Abstract:

Transient voltage suppressor semiconductor devices and other semiconductor devices having rigorous requirements for the diffusion and depth of impurities to produce P-N junctions can be fabricated at surprisingly low costs without sacrifice of functional characteristics by subjecting the substrate to a grinding process resulting in a surface short of polishing perfection, thereby to eliminate the time-consuming and hence costly conventional polishing operation, and then diffusing the desired impurity into the substrate from a solid impurity source.

US Patent:

20200034777, Jan 30, 2020

Filed:

Jul 26, 2019

Appl. No.:

16/523256

Inventors:

John P. Amato - Scotch Plains NJ, US
Frank S. Ciminello - Scotch Plains NJ, US

International Classification:

G06Q 10/06

Abstract:

The present invention is directed to a system and method for identifying top performing individuals who offer specialized services within a given professional field based on evaluations of the skill, training, background, and professional assessment of qualifying individuals. In one embodiment of the invention, a solicitation board is formed to solicit nominees working within a given field relative to pre-determined criteria. The criteria comprise a non-exhaustive list of attributes by which a hypothetical professional is measured for purposes of determining a top performer. Criteria is used to form a first tier of candidates, who are assessed by the solicitation board to form a second tier of candidates. A review board will successively review information associated with candidates of the second tier, to create subsequent tiers of candidates who are considered as among a top tier of professionals within a locale. In an alternative embodiment, the method of the present invention will include a consideration of surveys from third parties who have first-hand knowledge of the implementation and use of a given candidate's education, training and skills in their chosen profession. The present invention provides a 360 degree evaluation of the professionals considered as forming the top tier of comparable professionals.