John R Bird

US Patent:

6719038, Apr 13, 2004

Filed:

Aug 8, 2002

Appl. No.:

10/215320

Inventors:

John Bird - Newton NH
Ralph I. Larson - Bolton MA
Lyne Doré North - Chelmsford MA
Paul Bussiere - Twin Mountain NH
Amy Allen - Amesbury MA

Assignee:

Celestica International Inc. - Toronto

International Classification:

F28F 700

US Classification:

165 803, 165185, 165121, 361697, 257722

Abstract:

A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

US Patent:

6912128, Jun 28, 2005

Filed:

Aug 8, 2002

Appl. No.:

10/215319

Inventors:

John Bird - Newton NH, US
Ralph I. Larson - Bolton MA, US
Lyne Doré North - Chelmsford MA, US
Paul Bussiere - Twin Mountain NH, US
Amy Allen - Amesbury MA, US

Assignee:

Celestica International Inc. - Toronto

International Classification:

H05H007/20

US Classification:

361695, 165 803, 165121, 165122, 257722, 361697, 361703

Abstract:

A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

US Patent:

6944023, Sep 13, 2005

Filed:

Oct 10, 2003

Appl. No.:

10/681945

Inventors:

John Bird - Newton NH, US
Paul Bussiere - Twin Mountain NH, US
Amy Allen - Amesbury MA, US
Ralph I. Larson - Bolton MA, US

Assignee:

Celestica International Inc. - Toronto

International Classification:

H05K007/20

US Classification:

361704, 361719, 257718, 257727

Abstract:

The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

US Patent:

20030066626, Apr 10, 2003

Filed:

Oct 3, 2002

Appl. No.:

10/264198

Inventors:

John Bird - Newton NH, US
Ralph Larson - Bolton MA, US
Lyne North - Chelmsford MA, US
Paul Bussiere - Twin Mountain NH, US
Amy Allen - Amesbury MA, US

International Classification:

F28F007/00
F28F001/00
F24H003/02

US Classification:

165/080300, 165/121000

Abstract:

The present invention comprises a heatsink adjacent a first device wherein a gas supply can be located to provide gas in any direction with respect to the heatsink. The gas supply may be realized as a fan, a blower, or a compressed gas source. The gas supply may be provided in any direction or in multiple directions. The heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises a radial shaped folded fin heatsink arranged for axial flow.

US Patent:

20090090550, Apr 9, 2009

Filed:

Oct 9, 2007

Appl. No.:

11/869385

Inventors:

John R. Bird - Newton NH, US

Assignee:

SUN MICROSYSTEMS, INC. - Santa Clara CA

International Classification:

H02B 1/20
H02B 1/015

US Classification:

174500

Abstract:

A cable management apparatus for housing and organizing cables includes a stationary member having a set of ribs bridged by at least one spine and forming a first side wall, a second side wall, and a bottom wall. Further, the cable management apparatus also includes a first movable member having a set of ribs bridged by at least one spine, such that, the first movable member is movable toward at least the first or the second side wall. A method for managing cables includes providing a stationary member having a plurality of ribs bridged by at least one spine and forming a first side wall, a second side wall, and a bottom wall. Further, the method for managing cables also includes, providing a first movable member having a plurality of ribs bridged by at least one spine, such that, the first movable member is movable toward at least the first or the second side wall.