John Carl Buckley

US Patent:

45345384, Aug 13, 1985

Filed:

Jul 8, 1983

Appl. No.:

6/512083

Inventors:

John J. Buckley - Baltimore MD
William T. Scott - Ellicott City MD

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

F16K 31143

US Classification:

251 62

Abstract:

A modular air shut-off valve, particularly useful within the air conditioning environmental control system of an aircraft, is provided, which comprises a housing sized for insertion into a duct of the air conditioning system, a vane pivotally mounted within the housing for pivotal movement between open and closed positions and having flexible portions along its edges contacting the housing in the closed position for providing a resilient seal and to allow pressure relief in the event of overpressure within the duct.

US Patent:

48403059, Jun 20, 1989

Filed:

Mar 30, 1987

Appl. No.:

7/032426

Inventors:

Michael J. Ankrom - Baltimore MD
Corey H. Bowcutt - Annapolis MD
John J. Buckley - Baltimore MD
James A. Rew - Millersville MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

B23K 3102

US Classification:

228232

Abstract:

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

US Patent:

46747044, Jun 23, 1987

Filed:

Dec 3, 1985

Appl. No.:

6/804034

Inventors:

Frank E. Altoz - Catonsville MD
John J. Buckley - Catonsville MD

Assignee:

The United States of America as represented by the Secretary of the Air
Force - Washington DC

International Classification:

B64C 2102

US Classification:

244 1R

Abstract:

A direct air cooling system 12 for electronics carried by aircraft. The cooling system provides a submerged air scoop 16 which directs outside air to several electronic modules 14. The air flows through passages 76 in the modules 14 which are adjacent to circuit boards 74, 78 bearing discrete electronic components 88. A foil layer 86 and aluminum fin stock help transfer heat from the electronic components to the directed air. Heated air is then exhausted through exhaust port 24 or 28.

US Patent:

50382012, Aug 6, 1991

Filed:

Nov 8, 1988

Appl. No.:

7/268909

Inventors:

Joe E. Brewer - Severna Park MD
John J. Buckley - Hanover MD

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

H01L 2302

US Classification:

357 81

Abstract:

Wafer scale integrated circuit apparatus wherein a full wafer scale semiconductor integrated wafer is adhesively secured to an essentially flat heat conducting non-metallic base member with the wafer and base member having coefficients of thermal expansion approximately equal to one another. A cable adapter assembly connected to an edge of the base member secures one or more multiconductor flat cables in position such that the conductors thereof, by means of a clamping arrangement make positive pressure contacts with contact points connected to electronic circuitry of the semiconductor wafer. Another wafer may be placed on an opposed surface of the base member and a second cable adapter assembly may be utilized to secure another multiconductor flat cable for making interconnection between contact points of the wafer on one surface with contact points of the wafer on the opposed surface of the base member. The arrangement constitutes a wafer module and a plurality of such identical wafer modules may be stacked one upon the other and placed in a housing which has heat conducting side walls for heat dissipation purposes. A cable link assembly traverses the flat cables held in position by the first cable adapter assemblies of the wafer modules in order to serve for the inputting and outputting of electrical signals.