John R Chapura

US Patent:

53783077, Jan 3, 1995

Filed:

Apr 28, 1993

Appl. No.:

8/054108

Inventors:

Steven L. Bard - Endwell NY
Gerald A. Bendz - Vestal NY
Michael J. Canestaro - Endicott NY
John R. Chapura - Endicott NY
Edward J. Frankoski - Newark Valley NY
Michael S. Horan - Maine NY
Jeffrey D. Jones - Newark Valley NY
James S. Kamperman - Endicott NY
John R. Kjelgaard - Whitney Point NY
Jack M. McCreary - Apalachin NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B08B 302

US Classification:

156639

Abstract:

A fluid treatment apparatus and method for applying first and second fluids (e. g. , etchant and water) to an article (e. g. , circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article and thereafter collected within the apparatus' common housing. The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injecters, each including at least two rows of fluid jet injectors therein. The collected fluids are each returned to the respective impingement means. Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e. g. , a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid.