John Robert Hansen

US Patent:

6493960, Dec 17, 2002

Filed:

Dec 5, 2000

Appl. No.:

09/730347

Inventors:

Jeffrey B. Taylor - Wyoming MN
John E. Hansen - Coon Rapids MN

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

F26B 516

US Classification:

34 80, 34416, 34307, 34310

Abstract:

An apparatus for drying the air inside of hermetically sealed electronic devices. The apparatus includes a desiccant part and an activation piece that is attached to the desiccant part. The desiccant part and activation piece are attached together and then covered, except for the portions where the two pieces are attached, with a polymer that has a low moisture vapor transmission rate, such as parylene. The apparatus may be added into an electronic device during assembly. The desiccant, or drying agent, is not activated, by removal of the activation piece, until prior to closure of the hermetically sealed electronic device.

US Patent:

6865804, Mar 15, 2005

Filed:

Aug 10, 2001

Appl. No.:

09/928224

Inventors:

Nick A. Youker - Fridley MN, US
James E. Blood - Brooklyn Park MN, US
John E. Hansen - Coon Rapids MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H05K003/02
H05K003/10

US Classification:

29846, 29825, 29832, 174260, 174 524, 361761, 361764, 361792, 361794, 361718, 361719, 361767, 361777

Abstract:

The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

US Patent:

7190069, Mar 13, 2007

Filed:

Oct 2, 2001

Appl. No.:

09/970145

Inventors:

Nick A. Youker - River Falls WI, US
Ronald L. Anderson - Lino Lakes MN, US
John E. Hansen - Coon Rapids MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01L 23/34
H01L 23/495
H01L 23/14

US Classification:

257723, 257702, 257666, 257668, 257724, 257E23066

Abstract:

A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

US Patent:

7344800, Mar 18, 2008

Filed:

Jun 2, 2004

Appl. No.:

10/858831

Inventors:

Nick A. Youker - River Falls WI, US
John E. Hansen - Coon Rapids MN, US
Lawrence D. Swanson - Lino Lakes MN, US
David Chizek - Fridley MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01M 2/36
H01M 2/06

US Classification:

429 72, 429161, 429181, 296232, 296234

Abstract:

An improved battery design which is particularly suitable for use in an implantable medical device is disclosed. The design utilizes a two-part case for the battery contents which allows freedom with respect to feedthrough locations and battery shape.

US Patent:

7405475, Jul 29, 2008

Filed:

Mar 8, 2007

Appl. No.:

11/683586

Inventors:

Nick A. Youker - River Falls WI, US
Ronald L. Anderson - Lino Lakes MN, US
John E. Hansen - Coon Rapids MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01L 23/14
H01L 23/34

US Classification:

257702, 257723, 257724, 257E23065

Abstract:

A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

US Patent:

7713790, May 11, 2010

Filed:

Jul 28, 2008

Appl. No.:

12/220711

Inventors:

Nick A. Youker - River Falls WI, US
Ronald L. Anderson - Lino Lakes MN, US
John E. Hansen - Coon Rapids MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01L 21/44
H01L 21/48

US Classification:

438123, 438107, 438125, 257E23066

Abstract:

A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

US Patent:

7719854, May 18, 2010

Filed:

Jul 31, 2003

Appl. No.:

10/632138

Inventors:

Nick A. Youker - River Falls WI, US
Lawrence D. Swanson - Lino Lakes MN, US
John E. Hansen - Coon Rapids MN, US
William J. Linder - Golden Valley MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H05K 7/02
H05K 7/06
H05K 7/08
H05K 7/10

US Classification:

361782, 361763, 361794

Abstract:

An assembly integrating commercially available capacitors into filtered feedthroughs. A feedthrough assembly comprises a plurality of Input/Output (I/O) conductors, wherein the I/O conductors pass through a hermetic seal such that a first end of the I/O conductors reside on a non-hermetic side of the hermetic seal and a second end of the I/O conductors reside on a hermetic side of the hermetic seal, a printed circuit interconnect substrate residing on the hermetic side of the hermetic seal, and a plurality of ceramic chip capacitors mounted on the printed circuit interconnect substrate, wherein a first end of each capacitor is connected via the interconnect to the second end of an I/O conductor and a second end of each capacitor is connected via the interconnect to a constant voltage level.

US Patent:

7794866, Sep 14, 2010

Filed:

Mar 5, 2008

Appl. No.:

12/043019

Inventors:

Nick A. Youker - River Falls WI, US
John E. Hansen - Coon Rapids MN, US
Lawrence D. Swanson - Lino Lakes MN, US
David Chizek - Fridley MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01M 2/06
H01M 2/36

US Classification:

429 72, 429161, 429181, 296232, 296234

Abstract:

An improved battery design which is particularly suitable for use in an implantable medical device is disclosed. The design utilizes a two-part case for the battery contents which allows freedom with respect to feedthrough locations and battery shape.