John Francis Hansen

US Patent:

6865804, Mar 15, 2005

Filed:

Aug 10, 2001

Appl. No.:

09/928224

Inventors:

Nick A. Youker - Fridley MN, US
James E. Blood - Brooklyn Park MN, US
John E. Hansen - Coon Rapids MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H05K003/02
H05K003/10

US Classification:

29846, 29825, 29832, 174260, 174 524, 361761, 361764, 361792, 361794, 361718, 361719, 361767, 361777

Abstract:

The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

US Patent:

8612003, Dec 17, 2013

Filed:

Feb 16, 2011

Appl. No.:

13/028532

Inventors:

Lawrence D. Swanson - White Bear Lake MN, US
John M. Edgell - Plymouth MN, US
John E. Hansen - Ham Lake MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

A61N 1/375

US Classification:

607 36

Abstract:

The present subject matter provides feedthrough or interconnect systems for components of an implantable medical device and methods for their manufacture. A feedthrough system includes a wire or nailhead having a protruded tip. The wire or nailhead extends from an aperture in an encasement of a first component and is connected to a terminal conductor adapted to electrically connect to circuitry within the encasement. A ribbon wire has a distal end adapted to electrically connect to a second component and a proximal end having a pattern adapted to fit to the protruded tip of the wire or nailhead to provide for subsequent attachment of the ribbon wire to the nailhead.

US Patent:

20100274230, Oct 28, 2010

Filed:

Feb 17, 2010

Appl. No.:

12/707252

Inventors:

John M. Edgell - Plymouth MN, US
Lawrence D. Swanson - White Bear Lake MN, US
John E. Hansen - Ham Lake MN, US
Abhi V. Chavan - Maple Grove MN, US

Assignee:

CARDIAC PACEMAKERS, INC. - St. Paul MN

International Classification:

A61B 17/00
B25B 23/142

US Classification:

606 1, 81478

Abstract:

Embodiments of the invention are related to tools for coupling leads to header assemblies for implantable medical devices, amongst other things. A wrench is configured so that if an axial force exceeding a first threshold is applied to a handle housing, then the housing handle will rotate with respect to a shaft. Other embodiments are also included herein.

US Patent:

20110082531, Apr 7, 2011

Filed:

Sep 9, 2010

Appl. No.:

12/878406

Inventors:

Lawrence D. Swanson - White Bear Lake MN, US
John M. Edgell - Plymouth MN, US
Nick A. Youker - River Falls WI, US
John E. Hansen - Ham Lake MN, US
David A. Chizek - Brooklyn Park MN, US

International Classification:

A61N 1/05
H01R 43/00

US Classification:

607119, 295921

Abstract:

The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.

US Patent:

20120271387, Oct 25, 2012

Filed:

Mar 30, 2012

Appl. No.:

13/435271

Inventors:

John M. Edgell - Plymouth MN, US
David M. Flynn - Lino Lakes MN, US
John E. Hansen - Ham Lake MN, US
Michael J. Kloosterboer - Minneapolis MN, US
Lawrence D. Swanson - White Bear Lake MN, US

International Classification:

A61N 1/00

US Classification:

607116

Abstract:

Some examples of an electrical contact spring for an implantable medical device includes a housing, rigid and tubular in shape, defining a housing passage extending along a longitudinal axis, from a proximal portion including a proximal lip that defines a proximal opening, to a distal portion including a distal lip that defines a distal opening and a spring disposed in the housing, the spring tubular in shape and defining a spring passage concentric to the housing passage, the spring including: a distal ring portion disposed adjacent the distal portion of the housing and physically coupled to the housing, a plurality of spring elements coupled to and extending from the distal ring portion toward the proximal portion of the housing and a proximal ring portion disposed adjacent the proximal portion of the housing, cantilevered and suspended inside of and spaced apart from the housing by the plurality of spring elements.

US Patent:

20140075752, Mar 20, 2014

Filed:

Nov 19, 2013

Appl. No.:

14/084227

Inventors:

John M. Edgell - Plymouth MN, US
John E. Hansen - Ham Lake MN, US

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H01R 43/16

US Classification:

29876

Abstract:

The present subject matter provides feedthrough or interconnect systems for components of an implantable medical device and methods for their manufacture. A feedthrough system includes a wire or nailhead having a protruded tip. The wire or nailhead extends from an aperture in an encasement of a first component and is connected to a terminal conductor adapted to electrically connect to circuitry within the encasement. A ribbon wire has a distal end adapted to electrically connect to a second component and a proximal end having a pattern adapted to fit to the protruded tip of the wire or nailhead to provide for subsequent attachment of the ribbon wire to the nailhead.

US Patent:

53186745, Jun 7, 1994

Filed:

Jun 30, 1993

Appl. No.:

8/085540

Inventors:

Fredrick E. Behr - Woodbury MN
Yuri Cheburkov - Woodbury MN
John C. Hansen - Lakeland MN

Assignee:

Minnesota Mining and Manufacturing Company - St. Paul MN

International Classification:

C25B 124
C25B 308

US Classification:

204 59F

Abstract:

A process for preparing perfluoroalkanesulfonyl fluorides, e. g. , perfluoromethanesulfonyl fluoride, comprises electrochemically fluorinating in the presence of anhydrous hydrogen fluoride at least one precursor compound selected from the group consisting of. alpha. ,. beta. -difluoroalkane-. beta. -sultones, e. g. , 1,1,2,2-tetrafluoroethane sultone, and the corresponding. alpha. -halocarbonylfluoroalkanesulfonyl halides, e. g. , fluorocarbonyldifluoromethanesulfonyl fluoride. The process can be used to prepare perfluoroalkanesulfonyl fluorides in good yield and can be, for example, both more electrically-efficient and more fluorine-efficient than the conventional preparative method involving the electrochemical fluorination of hydrocarbon alkanesulfonyl halides.

US Patent:

62883445, Sep 11, 2001

Filed:

Aug 20, 1999

Appl. No.:

9/378407

Inventors:

Nick A. Youker - Fridley MN
James E. Blood - Brooklyn Park MN
John E. Hansen - Coon Rapids MN

Assignee:

Cardiac Pacemakers, Inc. - St. Paul MN

International Classification:

H05K 103
H05K 116
H05K 702

US Classification:

174255

Abstract:

The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, an IC chip carrier comprises an insulating ceramic substrate and at least one internal electrically conductive layer being a circuit ground, portions of which extend to the edge of the substrate, the internal electrically conductive layer in electrical contact with an electrically conductive layer applied to a portion of the substrate edge. This provides a horizontal hybrid ground plane which can be used as an EMI shield that runs horizontally to the chip as well as a hybrid edge EMI shield perpendicular along at least a portion of the edge. This edge shield protects internal circuitry from exterior EMI emissions directed towards the chip carrier edge portion incorporating the shield.

Address:

4105 Rubidoux Dr, Las Vegas, NV 89108

VIN:

1FTPX02537KA56757

Make:

FORD

Model:

F150

Year:

2007

Address:

3436 Yorkminster St, Las Vegas, NV 89129

VIN:

JHMGD38627S008238

Make:

HONDA

Model:

FIT

Year:

2007