2526 E Brierfield Dr, Eagle, ID 83616 • 2089382758
Nampa, ID
McCall, ID
Boise, ID
Hardin, IL
Us Patents
Vibrational Method Of Aligning The Leads Of Surface-Mount Electronic Components With The Mounting Pads Of Printed Circuit Boards During The Molten Solder Mounting Process
During solder-reflow attachment of surface-mount electronic components to a printed circuit board, vibrational energy sufficient to overcome the static coefficient of friction between the leads of a component and their respective connector pads is applied to the board, with the result that the surface tension of the molten solder between the leads and the pads will produce a best-fit alignment of the leads of each component on their corresponding connector pads.
Colonial Baptist Church Kindergarten Memphis TN 1960-1961, Willow Oaks Elementary School Memphis TN 1961-1962, Eisenhower Elementary School South Holland IL 1965-1968, Coolidge Junior High School Phoenix IL 1968-1969, Kenmore Junior High School Arlington VA 1969-1970
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Debra Orren, Becky Mayben, Margaret Beardall, Nathalie Helene, Jeannie Weaver, Ana Bruder, Joe Stahl, Melissa Craig, Deborah Steele