John Joseph O'Connor

US Patent:

6894853, May 17, 2005

Filed:

May 10, 2002

Appl. No.:

10/143232

Inventors:

Bradley Morgan Haskett - Allen TX, US
John Patrick O'Connor - Fort Worth TX, US
Steven E. Smith - Coppell TX, US
Mark Myron Miller - Plano TX, US
Ivan Kmecko - Dallas TX, US
Jwei Wien Liu - Plano TX, US
Edward Carl Fisher - Lucas TX, US
Frank O. Armstrong - Wylie TX, US
Daniel C. Estabrook - Plano TX, US
Jeffrey E. Farris - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

G02B007/00
H01L023/02
H01L023/12

US Classification:

359894, 257680, 257704

Abstract:

An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.

US Patent:

7163838, Jan 16, 2007

Filed:

Jul 22, 2002

Appl. No.:

10/200684

Inventors:

Bradley M. Haskett - Allen TX, US
John Patrick O'Connor - Fort Worth TX, US
Jwei Wien Liu - Plano TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/44

US Classification:

438106, 438124, 438127, 257E23118, 257E23124

Abstract:

An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.

US Patent:

7314816, Jan 1, 2008

Filed:

Mar 1, 2005

Appl. No.:

11/070547

Inventors:

Jwei Wien Liu - Plano TX, US
John P. O'Connor - Fort Worth TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/44

US Classification:

438612, 438666

Abstract:

A package that resists creation of particles in a package cavity. A package according to one embodiment of the present invention contains a mechanical device attached to the floor of the package substrate. Epoxy typically is used to attach the device. Electrical connections are provided by bond wires connecting bond pads on the substrate with bond pads on the device. A window is attached to the substrate to form a cavity around the device. A thin masking layer on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer may be any material that resists particle generation. The masking layer on the cavity walls optionally extends out of the cavity and onto the upper surface of the package.

US Patent:

7402458, Jul 22, 2008

Filed:

Apr 28, 2005

Appl. No.:

11/118854

Inventors:

Bradley Morgan Haskett - Allen TX, US
John Patrick O'Connor - Fort Worth TX, US
Steven E. Smith - Coppell TX, US
Mark Myron Miller - Plano TX, US
Ivan Kmecko - Dallas TX, US
Jwei Wien Liu - Plano TX, US
Edward Carl Fisher - Lucas TX, US
Frank O. Armstrong - Wylie TX, US
Daniel C. Estabrook - Plano TX, US
Jeffrey E. Faris - Richardson TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 21/50
H01L 21/48
H01L 21/44
H01L 23/29
H01L 23/31

US Classification:

438106, 438124, 438 27, 257E23118, 257E23124

Abstract:

An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a “U” shape, an inverted “U” shape, a curved step shape, or other combinations thereof.

US Patent:

7936033, May 3, 2011

Filed:

Dec 29, 2008

Appl. No.:

12/345421

Inventors:

Bradley Morgan Haskett - Allen TX, US
John Patrick O'Connor - Irving TX, US
Mark Myron Miller - McKinney TX, US
Sean Timothy Crowley - Parker TX, US
Jeffery Alan Miks - Chandler AZ, US
Mark Phillip Popovich - Tokyo, JP

Assignee:

Texas Instruments Incorporated - Dallas TX
Amkor Technology, Inc. - Chandler AZ

International Classification:

H01L 31/0203

US Classification:

257433, 257434, 257E23128, 257E21499, 438116

Abstract:

According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

US Patent:

20030000737, Jan 2, 2003

Filed:

Jul 1, 2002

Appl. No.:

10/186441

Inventors:

Jwei Liu - Plano TX, US
John O'Connor - Fort Worth TX, US

International Classification:

H01L023/14
H05K007/02

US Classification:

174/256000, 257/704000, 257/680000, 174/052400, 361/762000, 361/761000

Abstract:

A package that resists creation of particles in a package cavity. The package is ideally suited for use with microelectromechanical devices. A package according to one embodiment of the present invention contains a mechanical device (), for example a micromirror device, attached to the floor () of the package substrate (). Epoxy () typically is used to attach the device (). Electrical connections are provided by bond wires () connecting bond pads () on the substrate () with bond pads on the device (). A window () is attached to the substrate () to form a cavity () around the device. A thin masking layer () on portions of the package cavity surface prevents the surface from generating particles. The thin masking layer () may be any material that resists particle generation. Malleable metals are ideal. For example, gold plating on the inner cavity walls bonds well to the ceramic surfaces, captures particles that are already loose, and resists chipping to avoid the generation of additional particles. The masking layer () on the cavity walls optionally extends out of the cavity and onto the upper surface of the package. The preceding abstract is submitted with the understanding that it only will be used to assist in determining, from a cursory inspection, the nature and gist of the technical disclosure as described in 37 C.F.R. 1.72(b). In no case should this abstract be used for interpreting the scope of any patent claims.

US Patent:

20110204464, Aug 25, 2011

Filed:

May 3, 2011

Appl. No.:

13/100004

Inventors:

Bradley Morgan Haskett - Allen TX, US
John Patrick O'Connor - Ft. Worth TX, US
Mark Myron Miller - McKinney TX, US
Sean Timothy Crowley - Parker TX, US
Jeffery Alan Miks - Chandler AZ, US
Mark Phillip Popovich - Tokyo, JP

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

H01L 31/0203

US Classification:

257433, 257E31117

Abstract:

According to one embodiment, a micro-optical device includes an electro-optical circuit and an annular frame disposed on a surface of a substrate. The electro-optical circuit has an active region that is encapsulated by a window and an interconnect region adjacent at least one edge of the electro-optical circuit. The annular frame extends around an outer periphery of the window and is separated from the window by a gap, the annular frame and the electro-optical circuit form a cavity for placement of a plurality of bonding wires the interconnect that electro-optical circuit to the substrate.

US Patent:

20070110947, May 17, 2007

Filed:

Jan 16, 2007

Appl. No.:

11/623482

Inventors:

Bradley Haskett - Allen TX, US
John O'Connor - Ft. Worth TX, US
Jwei Liu - Plano TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

B32B 3/02

US Classification:

428068000

Abstract:

An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.