John Robert Platt

US Patent:

39598225, May 25, 1976

Filed:

Feb 14, 1975

Appl. No.:

5/550005

Inventors:

John D. Platt - South Laguna CA

Assignee:

MSI Data Corporation - Costa Mesa CA

International Classification:

G11B 2100
G11B 1524
G11B 1532
B65H 1702

US Classification:

360 96

Abstract:

A tape transport assembly for a cassette tape cartridge adapted for releasably mounting the cartridge for a transducing operation. A pivotal headplate is mounted on the base member adjacent to a capstan and carries a pinch roller and a transducer to allow the pinch roller to engage the capstan with the tape for advancing the tape from reel to reel when the plate is swung towards the capstan to effect a transducing operation. A radius arm is pivoted to the transport assembly and pivotally carries the head plate. The radius arm may be automatically controlled for moving it into engagement with a resilient mounting means for the head plate to pivot the radius arm and thereby the head plate to allow a tape rewind operation.

US Patent:

47822899, Nov 1, 1988

Filed:

May 30, 1986

Appl. No.:

6/869131

Inventors:

Charles H. Schwar - Irvine CA
John D. Platt - South Laguna CA

Assignee:

Hilevel Technology, Inc. - Irvine CA

International Classification:

G01R 3102

US Classification:

324158F

Abstract:

A fixture for clamping an integrated circuit chip testing board having a plurality of contact points to a testing platform having a plurality of corresponding protruding metal pins. The fixture includes a hinged cover with a latch for automatically aligning the testing board parallel to the testing platform and a means for automatically disabling the power supplied to the testing platform when the cover is opened and enabling the power when the cover is closed. The automatic alignment of the testing board parallel to the testing platform assures that the electrical connections between the contact points and their corresponding metal pins are substantially identical to thereby reduce testing errors caused by nonuniformity in the electrical interconnections.