John C Summers

US Patent:

7348373, Mar 25, 2008

Filed:

Feb 19, 2004

Appl. No.:

10/782326

Inventors:

Thomas E. Dueber - Wilmington DE, US
John D. Summers - Chapel Hill NC, US
Xin Fang - Newark DE, US

Assignee:

E.I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08G 73/10

US Classification:

524107, 523212, 524111, 524113, 524356, 524359, 524361, 524362, 524363, 524364, 524366, 524375, 524379, 524384, 524430, 524538

Abstract:

Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250 C. , have a water absorption factor of less than 2%, and a have a positive solubility measurement.

US Patent:

7745516, Jun 29, 2010

Filed:

Oct 12, 2005

Appl. No.:

11/248803

Inventors:

Thomas Eugene Dueber - Wilmington DE, US
John D. Summers - Chapel Hill NC, US
Brian C. Auman - Pickerington OH, US
Munirpallam Appadorai Subramanian - Corvallis OR, US
Nyrissa S. Rogado - Wilmington DE, US

Assignee:

E. I. du Pont de Nemours and Company - Wilmington DE

International Classification:

C08K 5/05
C08K 5/10
C08K 5/103
C08L 79/08
B32B 15/08

US Classification:

523455, 523445, 523456, 523457, 523458, 523466, 523468, 525423, 428416

Abstract:

Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250 C. , a water absorption factor of less than 2%, and a positive solubility measurement.

US Patent:

8270145, Sep 18, 2012

Filed:

Dec 4, 2007

Appl. No.:

11/949914

Inventors:

Thomas Eugene Dueber - Wilmington DE, US
John D. Summers - Chapel Hill NC, US

Assignee:

CDA Processing Limited Liability Company - Wilmington DE

International Classification:

H01G 4/06
C08K 5/07
C08G 18/42

US Classification:

3613211, 524357, 524361, 524362

Abstract:

This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.

US Patent:

20070244267, Oct 18, 2007

Filed:

Apr 10, 2006

Appl. No.:

11/401150

Inventors:

Thomas Dueber - Wilmington DE, US
John Summers - Chapel Hill NC, US
William Borland - Cary NC, US
Olga Renovales - Apex NC, US
Diptarka Majumdar - Cary NC, US
Daniel Amey - Durham NC, US

International Classification:

C08L 63/00

US Classification:

525523000, 523457000

Abstract:

Compositions comprising: an epoxy containing cyclic olefin resin with a water absorption of 2% or less; one or more phenolic resins with water absorption of less than 2% or less; an epoxy catalyst; optionally one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a cure temperature of 190 C. or less.

US Patent:

20070290379, Dec 20, 2007

Filed:

Jun 15, 2006

Appl. No.:

11/453388

Inventors:

Thomas E. Dueber - Wilmington DE, US
John D. Summers - Chapel Hill NC, US

International Classification:

H01L 23/29

US Classification:

257792

Abstract:

Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190 C. or less.

US Patent:

20070291440, Dec 20, 2007

Filed:

Jun 15, 2006

Appl. No.:

11/453359

Inventors:

Thomas E. Dueber - Wilmington DE, US
John D. Summers - Chapel Hill NC, US

International Classification:

H01G 4/00

US Classification:

3613013

Abstract:

Disclosed is an organic encapsulant composition that, when applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards, allows the capacitor to resist printed wiring board chemicals and survive accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.

US Patent:

20130180583, Jul 18, 2013

Filed:

Jan 14, 2013

Appl. No.:

13/740449

Inventors:

E I DU PONT DE NEMOURS AND COMPANY - Wilmington DE, US
John D. Summers - Chapel Hill NC, US

Assignee:

E I DU PONT DE NEMOURS AND COMPANY - Wilmington DE

International Classification:

H01L 31/0224

US Classification:

136256, 252500, 252514

Abstract:

This invention relates to thick film conductive paste comprised of one or more electrically conductive powders, one or more glass fits, and an organic medium comprising solvent and cellulose ester resin. This paste enables fine line printing in the manufacture of soar cells and exhibits reduced line spreading during the drying and firing steps. Paste stability is also improved. Also provided is a semiconductor device comprising an electrode formed from the thick film conductive paste.

US Patent:

52024121, Apr 13, 1993

Filed:

Oct 2, 1990

Appl. No.:

7/591225

Inventors:

Brian C. Auman - Newark DE
John D. Summers - Newtown Square PA

Assignee:

E. I. Du Pont de Nemours and Company - Wilmington DE

International Classification:

C08L 7908
C08G 6926

US Classification:

528353

Abstract:

Soluble polymeric precursors having oligomeric imide and amic acid segments, which are suitable to form segmented, preferably insoluble, polyimide copolymers.