John J Summers

US Patent:

52471330, Sep 21, 1993

Filed:

Aug 29, 1991

Appl. No.:

7/751854

Inventors:

David A. Wiemann - Mesa AZ
James E. Jaskie - Scottsdale AZ
John Summers - Apache Junction AZ
Robert C. Kane - Woodstock IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302

US Classification:

174 17R

Abstract:

An enclosure providing an evacuated region about an array of microelectronic vacuum devices including a substrate, a first encapsulation member defining a cavity, a second encapsulation member defining a cavity and mating with the first encapsulation member so as to define an encapsulated region, a ledge formed in the first encapsulation member for supporting the substrate and defining a communicating passage between the cavities and a sealing agent disposed between the mating surfaces of the encapsulation members to effect a vacuum seal such that when the encapsulated region is evacuated it will be at the same vacuum levels throughout to eliminate differential pressure induced deformation of the substrate. The evacuated substrate enclosure further provides for assembly without an evacuated environment.