John R Tate

US Patent:

6352437, Mar 5, 2002

Filed:

Oct 20, 1999

Appl. No.:

09/420711

Inventors:

John O. Tate - Lincoln RI 02865

International Classification:

H01R 909

US Classification:

439 83

Abstract:

A solder ball terminal includes a body portion, a spherical socket disposed at one end of the body portion, the spherical socket including an interior wall terminating in an annular lip, wherein the annular lip defines an opening of the spherical socket and a solder ball disposed within the socket such that a portion of the solder ball extends through the opening and beyond the annular lip.

US Patent:

6861862, Mar 1, 2005

Filed:

Mar 17, 2003

Appl. No.:

10/387841

Inventors:

John O. Tate - Lincoln RI, US

International Classification:

G01R031/02
H01R013/24

US Classification:

324761, 324758, 439700

Abstract:

A test socket including a contactor having a distal end which is received within a tapered retainer for guiding the distal end of the contactor and into a terminal housing having a counterbore such that movement of the distal end of the contactor is restricted by the counterbore of the terminal is disclosed.

US Patent:

55888470, Dec 31, 1996

Filed:

Apr 13, 1995

Appl. No.:

8/421839

Inventors:

John O. Tate - Uxbridge MA

International Classification:

H01R 909

US Classification:

439 71

Abstract:

A chip carrier mounting system of the present invention includes a chip carrier socket which is mounted (e. g. , by soldering) on a printed circuit board. The chip carrier socket has a frame and a plurality of spaced-apart, inwardly projecting contact members constructed of electrically conductive material. The system further includes a chip carrier constructed and arranged for receiving and securing a chip thereto. The chip carrier includes a frame having a plurality of spaced-apart receiving slots in registry with and capable of receiving the contact members therein for securing the chip carrier to the chip carrier socket. Each receiving slot has an electrically conductive surface mount for providing electrical connection between the chip, chip carrier, chip carrier socket and printed circuit board. The system also includes a retaining clip releasably securable to the chip carrier socket for maintaining the chip carrier and chip carrier socket in assembled relation.

US Patent:

49132865, Apr 3, 1990

Filed:

Jun 23, 1989

Appl. No.:

7/371701

Inventors:

John O. Tate - Uxbridge MA

International Classification:

B65D 7302

US Classification:

206329

Abstract:

A socket terminal carrier assembly includes a substantially rigid carrier board having a plurality of apertures therein, a plurality of carrier pins secured in the apertures and a plurality of socket terminals releasably received on the carrier pins so that they project outwardly in a predetermined array from one side of the carrier board. The socket terminal carrier assembly is operable for assembling the socket terminals thereof with a circuit board by positioning the assembly so that the pin portions of the socket terminals are received in apertures in the circuit board and then soldering the pin portions of the socket terminals in the apertures.

US Patent:

20200375037, Nov 26, 2020

Filed:

Aug 12, 2020

Appl. No.:

16/991073

Inventors:

John O. Tate - Lincoln RI, US

International Classification:

H05K 3/34
H01R 13/187
H01R 13/24

Abstract:

An insulated socket body and terminal assembly for an integrated chip includes upper and lower insulated socket body portions which are received together in mated relation to define a socket body having a plurality of lumens extending therethrough. The assembly further includes a like plurality of monolithic spring terminals received within the lumens, wherein the spring terminals include upper and lower contact ends connected by a central cantilever spring. The central cantilever springs are received within central recess portions of the lumens and the upper and lower contact ends are received in respective upper and lower guide portions of the lumens and project outwardly from respective upper and lower surfaces of the upper and lower insulated socket body portions. The central recess portions of the lumens are configured to retain the cantilever springs in a first uncompressed configuration and in a second compressed configuration.

US Patent:

20200266567, Aug 20, 2020

Filed:

Feb 14, 2020

Appl. No.:

16/791952

Inventors:

John O. Tate - Lincoln RI, US

International Classification:

H01R 13/24
H01R 13/502
H01R 12/85

Abstract:

An insulated socket body and terminal assembly for an integrated chip includes upper and lower insulated socket body portions which are received together in mated relation to define a socket body having a plurality of lumens extending therethrough. The assembly further includes a like plurality of monolithic spring terminals received within the lumens, wherein the spring terminals include upper and lower contact ends connected by a central cantilever spring. The central cantilever springs are received within central recess portions of the lumens and the upper and lower contact ends are received in respective upper and lower guide portions of the lumens and project outwardly from respective upper and lower surfaces of the upper and lower insulated socket body portions. The central recess portions of the lumens are configured to retain the cantilever springs in a first uncompressed configuration and in a second compressed configuration.

US Patent:

20190319386, Oct 17, 2019

Filed:

Nov 14, 2018

Appl. No.:

16/190773

Inventors:

John O. Tate - Lincoln RI, US

International Classification:

H01R 13/11
H01R 43/16
H01R 12/70
H01R 13/20
H01R 12/71

Abstract:

An electronic device socket includes a barrel having a lumen extending therethrough. The barrel includes a proximal barrel portion having a first outer diameter; a tapering region extending distally from the proximal barrel portion, the tapering region extending both distally and radially inward towards a central axis of the barrel; a plurality of fingers extending distally from the tapering region, the plurality of fingers are all parallel to one another and the central axis; and a dimple contact area extending from each of the plurality of fingers extending radially inward and distally. The barrel is configured to make full contact with an electronic pin only at the dimple contact area.