John G Torok

US Patent:

6462271, Oct 8, 2002

Filed:

Dec 27, 2000

Appl. No.:

09/748829

Inventors:

Jeffrey T. Coffin - Pleasant Valley NY
Lewis S. Goldmann - Bedford NY
John G. Torok - Poughkeepsie NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

174 521, 361707, 361711, 361714, 361719

Abstract:

A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

US Patent:

6485311, Nov 26, 2002

Filed:

Mar 20, 2001

Appl. No.:

09/812317

Inventors:

John G. Torok - Poughkeepsie NY
Gary F. Goth - Pleasant Valley NY
John J. Loparco - Poughkeepsie NY
Kent D. Waddell - West Hurley NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 1200

US Classification:

439 73, 361767

Abstract:

An exemplary embodiment of the invention is an actuation system including a printed circuit board having a plurality of interconnects and a compression connector positioned adjacent the printed circuit board and having a plurality of contacts for engaging the interconnects. A processing module is positioned adjacent the compression connector. The processing module has a base and a plurality of terminals for engaging contacts on the compression connector. An actuator includes a fastener that engages the base of the processing module and a biasing member for maintaining a force on the compression connector.

US Patent:

6921272, Jul 26, 2005

Filed:

May 12, 2003

Appl. No.:

10/435917

Inventors:

William P. Kostenko - Poughkeepsie NY, US
John J. Loparco - Poughkeepsie NY, US
Budy D. Notohardjono - Poughkeepsie NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R012/00

US Classification:

439 73, 439591

Abstract:

An electrical contact assembly includes a first module having a first set of electrical contacts, a second module having a second set of electrical contacts, a shape-generating module, and a clamping arrangement. The second set of electrical contacts is aligned with the first set of electrical contacts and the shape-generating module is arranged to impart a shape to the second module such that the second set of electrical contacts is driven toward the first set of electrical contacts. The clamping arrangement is arranged to clamp the first, the second, and the shape-generating modules together, thereby resulting in a positive contact force between the first and second sets of electrical contacts. The positive contact force is equal to or greater than a predefined value.

US Patent:

6954984, Oct 18, 2005

Filed:

Jul 25, 2002

Appl. No.:

10/202726

Inventors:

Michael F. McAllister - Clintondale NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K003/30

US Classification:

29832, 29825, 29827, 29830, 29831, 29846, 29854, 174254, 174260, 174262

Abstract:

A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

US Patent:

7077660, Jul 18, 2006

Filed:

Feb 10, 2004

Appl. No.:

10/775922

Inventors:

Michael F. McAllister - Clintondale NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 12/00

US Classification:

439 66, 439 70

Abstract:

A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both.

US Patent:

7079381, Jul 18, 2006

Filed:

Jan 7, 2004

Appl. No.:

10/752969

Inventors:

George W. Brehm - Holmes NY, US
Keith E. Barton - Hyde Park NY, US
John J. Loparco - Poughkeepsie NY, US
Robert K. Mullady - Highland NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G06F 1/16

US Classification:

361685, 361802, 439148, 398 79

Abstract:

An aligning apparatus comprising: a back plane, the back plane comprising at least one back plane connector; at least one daughter card, the daughter card comprising: a lower edge, the lower edge comprising a scalloped surface proximal to a rear surface of the lower edge, and a ramped surface proximal to a front surface of the lower edge; and a daughter card connector, the daughter card connector configured to be removably connectable to the back plane connector; and at least two guide rails extending from the back plane, the guide rail comprising a rear ramp and a front ramp. A method of aligning a daughter card to a back plane, the method comprising: sliding the daughter card towards the back plane; lifting the front end of the daughter; lifting the back end of the daughter card after lifting the front end of the daughter card; and providing the back end of the daughter card with a degree of freedom to lift and lower in order to align to the back plane, after lifting the back end of the daughter card.

US Patent:

7083477, Aug 1, 2006

Filed:

Jul 29, 2005

Appl. No.:

11/193822

Inventors:

William Louis Brodsky - Binghamton NY, US
Michael F. Scanlon - Poughkeepsie NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01R 9/22

US Classification:

439712

Abstract:

A connector system includes a first connector assembly that is electrically connected to wiring on a first printed wiring board and a second connector assembly that is electrically connected to wiring on a second printed wiring board. Each connector assembly includes a number of connector modules that are joined together in a predetermined array such as a row. In one of the connector assemblies, the row also includes one or more actuation modules. The actuation module or modules are engaged by an actuator mechanism to force the connector assemblies into mating engagement or to draw them apart.

US Patent:

7119433, Oct 10, 2006

Filed:

Jun 16, 2004

Appl. No.:

10/869524

Inventors:

Gary F. Goth - Pleasant Valley NY, US
Dales M. Kent - Round Rock TX, US
William P. Kostenko - Poughkeepsie NY, US
Roger R. Schmidt - Poughkeepsie NY, US
John G. Torok - Poughkeepsie NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 23/34
H01L 23/12

US Classification:

257706, 257704, 257E23103

Abstract:

In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.