Johnny Paul Cook

US Patent:

62561995, Jul 3, 2001

Filed:

Oct 1, 1999

Appl. No.:

9/410648

Inventors:

Imran Yusuf - Tempe AZ
Hong Xie - Phoenix AZ
Johnny M. Cook - Glendale AZ
Peter Brandenburger - Chandler AZ
Biju Chandran - Chandler AZ
Hamid Ekhlassi - Chandler AZ

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361699

Abstract:

An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

US Patent:

20020079571, Jun 27, 2002

Filed:

Aug 24, 1999

Appl. No.:

09/379537

Inventors:

TIMOTHY M. TAKEUCHI - TEMPE AZ, US
IMRAN YUSUF - TEMPE AZ, US
JOHNNY M. COOK JR. - GLENDALE AZ, US

International Classification:

H01L023/10

US Classification:

257/706000

Abstract:

A microelectronic package comprises a substrate, a electronic chip mounted on the substrate, a thermal interface material, a spring clip, and a retention frame. The thermal interface material is located between the electronic chip and the slug and is capable of thermally coupling the electronic chip to a slug without curing. The spring clip is located between the retention frame and the slug. In the assembled microelectronic package, the retention frame caps the substrate, and the spring clip applies a constant force to the slug to ensure reliable and continuous thermal contact between the electronic chip and the slug.