Jon K Danielson

US Patent:

20210307196, Sep 30, 2021

Filed:

Mar 31, 2020

Appl. No.:

16/835685

Inventors:

- Fort Collins CO, US
Jon Danielson - Fort Collins CO, US

International Classification:

H05K 7/20

Abstract:

Heat transfer systems and methods are disclosed. A heat transfer system includes an electronic enclosure that houses electronic components and includes a volume for a first fluid. A cold plate within the electronic enclosure is configured to contain a second fluid, and the cold plate includes a recess providing access to the second fluid. The heat transfer system also includes a heat transfer device configured to transfer heat from the first fluid to the second fluid. The heat transfer device is a single integrated piece that is situated within the recess wherein a first surface of the heat transfer device is configured to directly interface with the first fluid and a second surface of the heat transfer device is configured to directly interface with the second fluid.