Jonathan E Goodwin

US Patent:

6400577, Jun 4, 2002

Filed:

Aug 30, 2001

Appl. No.:

09/943596

Inventors:

Jonathan W. Goodwin - Braintree MA
Chuanlong Yue - North Attleboro MA
Curtis G. Knaub - North Attleboro MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H05K 900

US Classification:

361816, 361818, 361704, 361709, 361800, 174 35 R, 174 35 MS, 174 35 GC, 257717, 257718, 257719

Abstract:

An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.

US Patent:

6442045, Aug 27, 2002

Filed:

Nov 7, 2001

Appl. No.:

10/036824

Inventors:

Jonathan W. Goodwin - Braintree MA
Curtis G. Knaub - North Attleboro MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H05K 900

US Classification:

361816, 361818, 174 35 R

Abstract:

A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame. Integral spacer abutments are provided on the bottom surface of the frame to provide a planar mounting surface for the socket and to precisely space the insulating sheet from the printed circuit board when the socket is mounted to the printed circuit board.

US Patent:

6545879, Apr 8, 2003

Filed:

Jan 10, 2002

Appl. No.:

10/044596

Inventors:

Jonathan W. Goodwin - Braintree MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H05K 702

US Classification:

361807, 361704, 361709, 361714, 361715, 361688, 361735, 361790, 361785, 361787

Abstract:

A method and apparatus for mounting a lidless semiconductor device. A lidless semiconductor device, such as a land grid array device comprising a substrate having a semiconductor die mounted thereon is disposed in a socket. The socket includes a plurality of resilient conductive members arranged in a predetermined contact array pattern for conductively coupling conductive contacts on a printed circuit board with corresponding contacts on the underside of the lidless semiconductor device. A first set of springs applies a predetermined force to the substrate to conductively couple the contacts on the substrate to the contacts on the printed circuit board via the conductive members of the socket. Another set of springs urges the bottom surface of a heat sink into thermally conductive abutting relation with the top surface of the semiconductor die. The pressure on the die is less than the pressure applied by the substrate so as to avoid damage to the semiconductor die.

US Patent:

6612851, Sep 2, 2003

Filed:

Apr 9, 2002

Appl. No.:

10/118731

Inventors:

Jonathan W. Goodwin - Braintree MA
Donald Amaral - Seekonk MA
William Petrocelli - Douglas MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01R 1200

US Classification:

439 66, 439 67

Abstract:

An electrical connector assembly is provided including first and second circuit boards proximate each other and each having a first side and a second side. The electrical connector assembly includes flex circuits electrically connected to the first and second sides of the first and second circuit boards and carrying electrical signals therebetween. The electrical connector assembly includes load cells having at least one bowed spring, a base plate, and a cover plate. The spring has a peak portion and end portions and is compressed between the base and cover plates. The peak portion engages one of the base and cover plates with the end portions engaging another of the base and cover plates to exert a load force on the base and cover plates. The load cells are aligned opposite each other on the first and second circuit boards and retain the flex circuits thereto.

US Patent:

6616469, Sep 9, 2003

Filed:

Mar 8, 2002

Appl. No.:

10/094152

Inventors:

Jonathan Goodwin - Braintree MA

Assignee:

Tyco Electronics Logistics AG - Steinich/SG

International Classification:

H01R 460

US Classification:

439196, 361699, 439485

Abstract:

The present invention provides an electrical and fluid interconnect for providing electrical connection between one or more circuits or electrical devices and a mateable circuit board or substrate, and for providing fluid coupling of a cooling fluid to permit fluid flow in relation to the electrical circuits or devices when mated to the circuit board or substrate. The fluid connector has a valve which in the absence of mating pressure is in a closed or off position. When mated to a fluid connector which is part of or coupled to the latch assembly, the valve is opened to permit fluid to flow.

US Patent:

6731505, May 4, 2004

Filed:

Dec 20, 2002

Appl. No.:

10/327189

Inventors:

Jonathan W. Goodwin - Braintree MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H05K 720

US Classification:

361719, 24458, 257719

Abstract:

A mounting system for an integrated circuit employs a novel load cell having a backing plate, a bow spring and a load distribution plate. The load cell controls the loading forces on contacts of an integrated circuit socket. A heat sink having a base includes a pedestal extending from the base that abuts the integrated circuit for purposes of heat removal. Springs are employed to provide loading forces for the heat sink that are lower than the loading forces for the integrated circuit socket contacts.

US Patent:

6790048, Sep 14, 2004

Filed:

Apr 23, 2002

Appl. No.:

10/128398

Inventors:

Jonathan Goodwin - Braintree MA
Donald Amaral, Jr. - Seekonk MA

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01R 1200

US Classification:

439 65, 439331, 439 67

Abstract:

A flex connector assembly for connecting circuit boards has been provided that includes a housing having at least one cavity holding a preloaded spring exerting an outwardly-directed force toward top and bottom ends of the housing; at least one pressure support member located at one of the top and bottom ends, the pressure support member exerting an inwardly-directed force on the preloaded spring; and at least one flex circuit having a flex array arranged on one of the top and bottom ends; and at least one compressible socket having a socket array overlapping the flex circuit. The preloaded spring acts to compress the flex array and the socket array onto one another.

US Patent:

6293810, Sep 25, 2001

Filed:

Feb 8, 2000

Appl. No.:

9/499772

Inventors:

Jonathan W. Goodwin - Braintree MA
Stephen DelPrete - Rehoboth MA
Steven Wakefield - Allston MA

Assignee:

Thomas & Betts International, Inc. - Sparks NV

International Classification:

H01R 1200

US Classification:

439 71

Abstract:

A socket for a BGA package is provided which is of relatively simple construction and which provides reliable and efficient interconnection of a BGA package and a printed circuit board. The socket comprises a contact assembly having an array of resilient conductive columns having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly is supported on a frame of insulating material and which has alignment posts for alignment of the contact assembly to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board. The frame also includes latch elements for retaining the contact assembly on the frame. The socket is mounted onto a printed circuit board which has an array of contact areas corresponding to the array of resilient contacts of the socket. A BGA package is placed onto the socket frame and the package is maintained in alignment on the frame such that the ball contacts engage the respective contacts of the contact assembly of the socket. The package is retained in the socket by a retention mechanism.