Active compensation of aberrations in an optical system involves attaching first and second force bars to a mirror. The first force bar is bifurcated to form an opening near its longitudinal midpoint. This opening defines first and second opposed surfaces. A second force bar is substantially perpendicular to the first force bar and extends through the opening of the first force bar so that a medial portion of the second force bar is disposed in the opening of the first force bar. The second force bar is connected to the first surface by at least one actuator. Longitudinal movement of the actuator causes a displacement of the mirror. A support structure is used to support the weight of the force bars and actuator. The force bars are connected to the support structure by a plurality of flexures. A control module receives information from a sensing module and controls the actuator.
Method And Apparatus For A Reticle With Purged Pellicle-To-Reticle Gap
A method and apparatus for maintaining a purged optical gap between a pellicle and a reticle in a photolithography system is described. A porous frame between a reticle and a pellicle maintains the purged optical gap. A porous frame includes a first and a second opposing surface. The first opposing surface defines a first opening, and is configured to mate with the pellicle. The second opposing surface defines a second opening, and is configured to mate with the reticle to enclose the optical gap between the pellicle and the reticle. A gas supply interface infuses a purge gas through the porous frame and into the gap.
Method And Apparatus For A Non-Contact Scavenging Seal
Eric C. Hansell - New Milford CT 06776 Jose V. Herrera - Stratford CT 06615 Richard L. Huse - Norwalk CT 06850 Jorge S. Ivaldi - Trumbull CT 06611 Stephen G. Krehley - Trumbull CT 06611 Thomas P. Shamaly - Shelton CT 06484
International Classification:
G03B 2752
US Classification:
355 30
Abstract:
A method and apparatus for providing a purged optical path between an optical source surface and an optical target surface and for permitting relative movement between the optical source surface and the optical target surface is described. The apparatus includes a body, a central cavity, at least one gas supply bore, and at least one gas removal bore. The body defines first and second opposing surfaces. The first opposing surface is configured for positioning closely adjacent to the optical target surface. The second opposing surface is configured to mate with the optical source surface. The central cavity is formed in the body for passing light through the body, the central cavity being open at the first and second opposing surfaces. The at least one gas supply bore is formed in the body for suppling a flow of a purge gas to the central cavity. The at least one gas removal bore is formed in the body at the first opposing surface to remove gas from a gap formed between the first opposing surface and the optical target surface.
System And Method For Reticle Protection And Transport
A reticle protection and transport system and method for a lithography tool. The system includes an indexer that stores a plurality of reticles and a removable reticle cassette. The removable reticle cassette is comprised of an inner chamber and an outer chamber. The system further includes an end effector coupled to a robotic arm. The end effector engages one of the plurality of reticles to enable the reticle to be positioned within the removable reticle cassette and thereafter transported. The system further includes a seal, coupled to the end effector and the robotic arm. To transport the reticle, the reticle is first loaded onto the end effector. Next, the end effector is used to create an arrangement wherein the reticle is loaded into the removable reticle cassette. Importantly, the reticle and removable reticle cassette do not come into contact with one another. The reticle and removable reticle cassette arrangement is then sealed and transported from the indexer to a mount for performing lithographic exposure.
Catadioptric Lithography System And Method With Reticle Stage Orthogonal To Wafer Stage
Harry Sewell - Wilton CT Jorge Ivaldi - Wilton CT John Shamaly - Wilton CT
Assignee:
ASML Holding N.V.
International Classification:
G02B 900
US Classification:
359754
Abstract:
The present invention relates to a lithography apparatus using catadioptric exposure optics that projects high quality images without image flip. The lithography apparatus includes a reticle stage, a wafer stage, and a catadioptric exposure optics located between the reticle stage and the wafer stage. The catadioptric exposure optics projects an image from the reticle stage onto the wafer stage. The projected image has the same image orientation as the image from the reticle stage. In other words, the catadioptric exposure optics does not perform image flip. The reticle stage lies on a first plane and the wafer stage lies on a second plane, where the first plane is orthogonal to the second plane. In another embodiment of the present invention, the catadioptric exposure optics projects an even number of reflections. The projected image is of high precision and lacks aberrations such as perspective warping and obscured areas.
Method And Apparatus For A Pellicle Frame With Heightened Bonding Surfaces
Joseph Laganza - Norwalk CT Jorge Ivaldi - Trumbull CT
Assignee:
ASML Holding N.V. - Veldhoven
International Classification:
G03B 2762
US Classification:
355 75, 355 53, 355 72
Abstract:
A method and apparatus for maintaining an optical gap between optical structures in a photolithography system is described. A frame defines first and second opposing surfaces. The first opposing surface defines a first opening and the second opposing surface defines a second opening. A plurality of spacing members are spaced apart on the first opposing surface around the first opening. The spacing members have substantially co-planar surfaces configured to mate with a surface of a first optical structure. A bonding agent seals a space around the first opening between the first opposing surface and the first optical structure. The frame thereby encloses the optical gap between the first optical structure and a second optical structure.
Method And Apparatus For A Pellicle Frame With Porous Filtering Inserts
Joseph Laganza - Norwalk CT, US Jorge Ivaldi - Trumbull CT, US Florence Luo - Valley Cottage NY, US
Assignee:
ASML Holding N.V. - Veldhoven
International Classification:
G03B 2762 G03B 2752 G03B 2742 G03F 900
US Classification:
355 75, 355 30, 355 53, 430 5
Abstract:
A method and apparatus for maintaining a purged optical gap between a pellicle and a reticle in a photolithography system. A frame between a reticle and a pellicle maintains the purged optical gap. The frame defines first and second opposing surfaces. The first opposing surface defines a first opening, and is configured to mate with the pellicle. The second opposing surface defines a second opening, and is configured to mate with the reticle to enclose the optical gap between the pellicle and the reticle. At least one edge of the frame has an opening therethrough. A porous sintered material fills each opening through an edge of the frame.
Catadioptric Lithography System And Method With Reticle Stage Orthogonal To Wafer Stage
Harry Sewell - Ridgefield CT, US Jorge Ivaldi - Trumbull CT, US John Shamaly - Shelton CT, US
Assignee:
ASML Holding N.V.
International Classification:
G03B027/42 G02B027/58 G02B009/00
US Classification:
355 53, 355 72, 359754
Abstract:
The present invention relates to a lithography apparatus and method using catadioptric exposure optics that projects high quality images without image flip. The apparatus includes means for illuminating a reticle stage to produce a patterned image. The apparatus also includes means for receiving the patterned image at each of a plurality of wafer stages. Each of the wafer stages has an associated data collection station. The apparatus also includes means for positioning the reticle stage substantially orthogonal to each of the plurality of wafer stages as well as means for directing the patterned image through a catadioptric exposure optics element between the reticle stage and each wafer stage to cause an even number of reflections of the patterned image and to project the patterned image onto each wafer stage in a congruent manner. The invention can also be combined with a dual isolation system.