Jose J Juarez

US Patent:

20230116550, Apr 13, 2023

Filed:

Oct 31, 2022

Appl. No.:

18/051289

Inventors:

- San Carlos CA, US
Malcom Parker Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Emily Hernandez - Belmont CA, US
Joseph Pratt - Sunnyvale CA, US
Peter Stone - Los Gatos CA, US
Vidya Viswanath - Sunnyvale CA, US
Will Findlay - San Carlos CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H05K 1/02
H01B 11/00

Abstract:

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

US Patent:

20210076485, Mar 11, 2021

Filed:

Nov 17, 2020

Appl. No.:

16/950155

Inventors:

- San Carlos CA, US
Malcolm Parker Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Emily Hernandez - Belmont CA, US
Joseph Pratt - Sunnyvale CA, US
Peter Stone - Los Gatos CA, US
Vidya Viswanath - Sunnyvale CA, US
Will Findlay - San Carlos CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H05K 1/02
H01B 11/00

Abstract:

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

US Patent:

20200245449, Jul 30, 2020

Filed:

Apr 16, 2020

Appl. No.:

16/850340

Inventors:

- San Carlos CA, US
Malcolm Parker Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Emily Hernandez - Belmont CA, US
Joseph Pratt - Sunnyvale CA, US
Peter Stone - Los Gatos CA, US
Vidya Viswanath - Sunnyvale CA, US
Will Findlay - San Carlos CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H05K 1/02
H01B 11/00
H05K 1/03

Abstract:

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

US Patent:

20190229449, Jul 25, 2019

Filed:

Apr 1, 2019

Appl. No.:

16/371708

Inventors:

- San Carlos CA, US
Malcolm Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Dongao Yang - Redwood City CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H01R 12/59
H01R 12/69
H01B 7/08
H05K 1/02
B60J 5/04
H01B 7/04
B60R 16/02
H01B 7/00
H01R 43/20

Abstract:

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

US Patent:

20190051999, Feb 14, 2019

Filed:

Oct 18, 2018

Appl. No.:

16/164722

Inventors:

- San Carlos CA, US
Malcolm Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Dongao Yang - Redwood City CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H01R 12/59
B60R 16/02
H05K 1/02
H01R 43/20
H01B 7/00
B60J 5/04
H01B 7/08
H01B 7/04
H01R 12/69
H01B 7/42

Abstract:

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

US Patent:

20180301832, Oct 18, 2018

Filed:

Apr 13, 2018

Appl. No.:

15/952773

Inventors:

- San Carlos CA, US
Malcolm Brown - Mountain View CA, US
Jose Juarez - Mountain View CA, US
Dongao Yang - Redwood City CA, US

Assignee:

CelLink Corporation - San Carlos CA

International Classification:

H01R 12/59
H01R 12/69
H01B 7/08
H01B 7/04
H01R 43/20
H01B 7/00
H05K 1/02
B60R 16/02
B60J 5/04

Abstract:

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.