Joseph A Carr

US Patent:

7589465, Sep 15, 2009

Filed:

Feb 7, 2005

Appl. No.:

11/052943

Inventors:

Joseph N. Carr - Chapel Hill NC, US

Assignee:

Osram Opto Semiconductors GmbH - Regensburg

International Classification:

H01J 19/70

US Classification:

313546, 313549, 313553

Abstract:

An embodiment of an encapsulated organic optoelectronic device is described. The encapsulated device includes a hybrid getter film which is composed of a getter and a handling agent.

US Patent:

20120314388, Dec 13, 2012

Filed:

Jun 7, 2012

Appl. No.:

13/491335

Inventors:

Christopher Bower - Raleigh NC, US
Joseph Carr - Chapel Hill NC, US

International Classification:

G03F 7/20
B29C 59/00
H05K 7/00
B29C 69/00

US Classification:

361760, 430325, 430319, 156219, 216 52

Abstract:

A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the intermediate substrate.

US Patent:

20130153934, Jun 20, 2013

Filed:

Jun 7, 2011

Appl. No.:

13/700411

Inventors:

Matthew Meitl - Durham NC, US
Joseph Carr - Chapel Hill NC, US
Scott Burroughs - Durham NC, US

International Classification:

H01L 31/0232
H01L 31/173

US Classification:

257 84, 438 24

Abstract:

A concentrated photovoltaic and display apparatus includes a backplane substrate, a plurality of photovoltaic elements distributed over the backplane substrate, a plurality of display elements distributed over the backplane substrate between the photovoltaic elements, and an optical element positioned over the backplane substrate, the photovoltaic elements, and the display elements. The optical element is configured to concentrate incident light propagating in a direction substantially parallel to an optical axis thereof onto the photovoltaic elements. The optical element is further configured to direct light reflected or emitted from the display elements in a direction that is not substantially parallel to the optical axis of the optical element. Related fabrication methods and arrays including the apparatus are also discussed.

US Patent:

20130273695, Oct 17, 2013

Filed:

Mar 22, 2011

Appl. No.:

13/638019

Inventors:

Etienne Menard - Limoges, FR
Joseph Carr - Chapel Hill NC, US

Assignee:

Semprius, Inc. - Durham NC

International Classification:

H01L 21/58

US Classification:

438118

Abstract:

A method for selectively transferring active components () from a source substrate () to a destination substrate () includes providing a source substrate with one or more active components located on the source substrate, providing a destination substrate, locating a selectively curable adhesive layer () between and adjacent to the destination substrate and the source substrate, selecting one or more active components (A), selectively curing area(s) (A) of the adhesive layer corresponding to the selected active components to adhere the selected active components to the destination substrate, and removing the source substrate from the destination substrate leaving the selected active components adhered to the destination substrate in the selected areas.

US Patent:

20210167100, Jun 3, 2021

Filed:

Feb 4, 2021

Appl. No.:

17/167945

Inventors:

- Dublin, IE
Etienne Menard - Voglans, FR
Matthew Meitl - Durham NC, US
Joseph Carr - Chapel Hill NC, US

International Classification:

H01L 27/12
H01L 21/84
H01L 21/3065
H01L 21/3205
H01L 21/768
H01L 29/786

Abstract:

Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer. The sacrificial layer may be selectively removed from between the first portion of the semiconductor active layer and the handling substrate to thereby define a suspended integrated circuit chip encapsulated by the capping layer.

US Patent:

20200395316, Dec 17, 2020

Filed:

Aug 28, 2020

Appl. No.:

17/006439

Inventors:

- Dublin, IE
Joseph Carr - Chapel Hill NC, US

International Classification:

H01L 23/00
H01L 21/66
H01L 25/065

Abstract:

A method of making a secure integrated-circuit system comprises providing a first integrated circuit in a first die having a first die size and providing a second integrated circuit in a second die. The second die size is smaller than the first die size. The second die is transfer printed onto the first die and connected to the first integrated circuit, forming a compound die. The compound die is packaged. The second integrated circuit is operable to monitor the operation of the first integrated circuit and provides a monitor signal responsive to the operation of the first integrated circuit. The first integrated circuit can be constructed in an insecure facility and the second integrated circuit can be constructed in a secure facility.

US Patent:

20200257537, Aug 13, 2020

Filed:

Feb 13, 2019

Appl. No.:

16/274704

Inventors:

- Baden, CH
Joseph A. Carr - Raleigh NC, US

International Classification:

G06F 9/38
G06F 9/50
G06F 9/48
H02J 3/14

Abstract:

Coordination of a plurality of resources is disclosed to respond to a local service target. A local measurement is taken by a first resource and, if the first resource cannot satisfy the local service target, short range recruitment of one or more additional resources is performed by providing a first signal to a cluster of resources associated with the first resource. If the short range recruitment does not satisfy the local service target, a second signal is provided to a network resource controller for long range recruitment of one or more resources to satisfy the local service target.

US Patent:

20200259329, Aug 13, 2020

Filed:

Feb 13, 2019

Appl. No.:

16/274314

Inventors:

- Baden, SE
Joseph A. Carr - Raleigh NC, US
Zhenyuan Wang - Apex NC, US

International Classification:

H02J 3/18
G05B 17/02
G06Q 30/02
G06Q 50/06

Abstract:

Architectures, apparatuses, methods, systems, and techniques for controlling electrical power distribution network are disclosed. Distributed, hierarchical controls including layered locational energy service control variables may be utilized to determine and control the provision of energy services, including real power, reactive power (VAR), and capacity reserves, by DERs in a distribution network. In a first ex-ante iteration a simulation may be performed to calculate a set of subnetwork-specific control variables based on subnetwork locational energy service prices and a plurality of sets of DER-specific control variables based on DER locational energy service prices. In a second ex-ante iteration a set of actual subnetwork-specific control variables based on subnetwork locational energy service prices and a plurality of sets of actual DER-specific control variables based on DER locational energy service prices. Provision of energy services by DERs in a distribution network occur in response to the determined control variables.