Joseph L Desjardins

US Patent:

47836970, Nov 8, 1988

Filed:

Sep 2, 1986

Appl. No.:

6/902901

Inventors:

Robert Benenati - Tamarac FL
Joseph Desjardins - Tamarac FL
James E. Mitzlaff - Carpentersville IL
Scott D. Beutler - Des Plaines IL
Mike M. Albert - Chicago IL
Vernon L. Brown - Barrington IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 3902
H02G 1308

US Classification:

357 80

Abstract:

A leadless chip carrier for RF power transistors or the like is disclosed which includes a body of insulating material having two major surfaces and side walls joining the major surfaces. In a first embodiment, a pattern of conductive pads is deposited on one major surface. A pattern of conductive contact areas is deposited on the other major surface and distributed interconnecting portions of conductive material are deposited to connect the pads to the respective contact areas. In a second embodiment, larger pads and contact areas are provided on a beryllia substrate to provide a leadless chip carrier for RF transistors capable of handling 8 watts. In a third embodiment, a single slot is made conductive to provide the distributed interconnecting portion for one terminal, while in a fourth embodiment, the slot is changed to a plurality of small, tungsten-filled through holes to provide a virtually hermetically sealed leadless chip carrier for RF power transistors.