Joseph M Freund

US Patent:

6384612, May 7, 2002

Filed:

Oct 7, 1998

Appl. No.:

09/168035

Inventors:

Joseph M. Freund - Fogelsville PA
George J. Przybylek - Douglasville PA
Dennis M. Romero - Allentown PA
John Stayt, Jr. - Schnecksville PA

Assignee:

Agere Systems Guardian Corporation - Miami Lakes FL

International Classification:

G01R 104

US Classification:

324750, 324753

Abstract:

A method for testing the light emitted by a group of semiconductor light emitting devices arranged to emit light over a testing area, each light emitting device having a p-contact, the method including connecting a plurality of selectively connectable p-contact probes to the p-contacts of respective light emitting devices in the group of light emitting devices, selectively activating one of the light emitting devices in the group of light emitting devices to emit light over the testing area by selectively supplying a predetermined electrical current to the p-contact of the selected light emitting device via its respective p-contact probe, guiding the light emitted by the selected light emitting device via a light funnel having a collection end and a detection end, the collection end being in juxtaposition with all the light emitting devices in the group of light emitting devices, and detecting light exiting the detection end of the light funnel.

US Patent:

6442306, Aug 27, 2002

Filed:

Dec 21, 1999

Appl. No.:

09/468448

Inventors:

Mindaugas Fernand Dautartas - Alburtis PA
Joseph Michael Freund - Fogelsville PA
Dennis Stefanik - Weisenberg Township, Lehigh County PA

Assignee:

Agere Systems Guardian Corp. - Orlando FL

International Classification:

G02B 626

US Classification:

385 15, 385 16, 385 17, 385 18

Abstract:

A fiber array connector is passively self-aligned to provide optical coupling between a first NÃM array of optical fibers and a second NÃM array of optical fibers. Each fiber array is inserted in a separate half of the connector, where each individual fiber is then supported through an aperture in a fiber array connector piece part. The connector piece part comprises a stack of substrate members, processed to include apertures for supporting the fibers in an array formation. The top substrate member of each stack is further processed to include alignment apertures so that as the two fiber array connector halves are mated the alignment fiducials on the connector piece parts will mate and self-align the fiber arrays.

US Patent:

6512291, Jan 28, 2003

Filed:

Feb 23, 2001

Appl. No.:

09/790811

Inventors:

Mindaugas F. Dautartas - Blacksburg VA
Joseph M. Freund - Fogelsville PA
George J. Przybylek - Douglasville PA

Assignee:

Agere Systems Inc. - Miami Lakes FL

International Classification:

H01L 2310

US Classification:

257706, 257707, 257930

Abstract:

A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.

US Patent:

6514791, Feb 4, 2003

Filed:

Feb 23, 2001

Appl. No.:

09/790526

Inventors:

Mindaugas F. Dautartas - Blacksburg VA
Joseph M. Freund - Fogelsville PA
George J. Przybylek - Douglasville PA

Assignee:

Agere Systems Inc. - Miami Lakes FL

International Classification:

H01L 2144

US Classification:

438106, 438 55, 438122

Abstract:

A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to secure, respectively, positively-doped and negatively-doped TEC elements. The elements are intermeshed and an encapsulating material is applied to the intermeshed array. The support structures are then released and the ends of the encapsulated elements are smoothed and electrically coupled together. If desired, panels are secured to the ends of the elements and a heat sink may also be provided. The TEC device may be used to control and/or tune a laser device.

US Patent:

6549550, Apr 15, 2003

Filed:

Feb 14, 2001

Appl. No.:

09/781995

Inventors:

Mindaugas F. Dautartas - Blacksburg VA
Joseph M. Freund - Fogelsville PA
John M. Geary - Macungie PA
George J. Pryzbylek - Douglasville PA

Assignee:

TriQuint Technology Holding Co. - Hillsboro OR

International Classification:

H01S 304

US Classification:

372 36, 372 43

Abstract:

Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity.

US Patent:

6555413, Apr 29, 2003

Filed:

Feb 23, 2001

Appl. No.:

09/790810

Inventors:

Joseph M. Freund - Fogelsville PA
George J. Przybylek - Douglasville PA
Mindaugas F. Dautartas - Blacksburg VA

Assignee:

TriQuint Technology Holding Co. - Hillsboro OR
Agere Systems, Inc. - Allentown PA

International Classification:

H01L 2144

US Classification:

438106, 438 15, 438 16, 438 51, 438 55, 438 65, 438 99, 438124, 438127, 438642, 257 40, 257100, 257432, 257678, 257787

Abstract:

A method for electrically coupling thermoelectric cooling (TEC) elements together is described. The TEC elements are encased within an encapsulating material, such as epoxy, and a resist layer is laid on either end of the encapsulating material, covering the ends of the TEC elements. The resist layers are selectively developed to open locations in the resist layers in between adjacent elements. Conductive material, such as gold, is sputter deposited into the locations to provide electrical coupling of the elements.

US Patent:

6577783, Jun 10, 2003

Filed:

Jun 24, 2002

Appl. No.:

10/179333

Inventors:

Mindaugas Fernand Dautartas - Alburtis PA
Joseph Michael Freund - Fogelsville PA
Dennis Stefanik - Weisenberg Township, Lehigh County PA

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

G02B 626

US Classification:

385 17, 385 15, 385 16, 385 18, 385 31

Abstract:

A fiber array connector is passively self-aligned to provide optical coupling between a first NÃM array of optical fibers and a second NÃM array of optical fibers. Each fiber array is inserted in a separate half of the connector, where each individual fiber is then supported through an aperture in a fiber array connector piece part. The connector piece part comprises a stack of substrate members, processed to include apertures for supporting the fibers in an array formation. The top substrate member of each stack is further processed to include alignment apertures so that as the two fiber array connector halves are mated the alignment fiducials on the connector piece parts will mate and self-align the fiber arrays.

US Patent:

6778309, Aug 17, 2004

Filed:

Aug 22, 2002

Appl. No.:

10/226184

Inventors:

Joseph Michael Freund - Fogelsville PA
Thomas Gordon Beck Mason - Bethlehem PA
Joseph Patrick Reynolds - Macungie PA
Robert Ehrler Tench - Allentown PA
Frank Stephen Walters - Kutztown PA

Assignee:

Triquint Technology Holding Co. - Hillsboro OR

International Classification:

G02F 103

US Classification:

359259, 359264, 359252

Abstract:

An electroabsorption modulator comprises a tandem arrangement of a conventional electroabsorption (EA) modulator element and a phase modulator element. The EA modulator element is driven by the digital data signal and the phase modulator is driven by a chirp tuning control signal, such as the complement of the data signal. By controlling the amplitude and/or bias of the chirp tuning control signal, the frequency chirp of the intensity-modulated output signal from the EA modulator element can be controlled.