Joseph Edward Geniac

US Patent:

6872098, Mar 29, 2005

Filed:

Jul 31, 2002

Appl. No.:

10/209377

Inventors:

Thomas Wojtacki - Greensboro NC, US
Kevin J. Peterson - High Point NC, US
Kurt T. Zarbock - Advance NC, US
Joseph E. Geniac - Greensboro NC, US
William J. Remaley - Walkertown NC, US
Michael G. Pacyga - Clemmons NC, US
Aurelio J. Gutierrez - Bonita CA, US

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01R024/00

US Classification:

439676, 639620

Abstract:

The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

US Patent:

7077702, Jul 18, 2006

Filed:

Aug 4, 2004

Appl. No.:

10/910996

Inventors:

Bobby Gene Ward - King NC, US
Wolfgang Hoelscher - Stokesdale NC, US
Joseph Edward Geniac - Greensboro NC, US

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01R 13/40

US Classification:

439595, 439292, 439752

Abstract:

A connector assembly comprising a cap member having a plurality of fixed cap terminal position assurance mechanisms defined thereon, and a plug member having one or more of fixed plug terminal position assurance mechanisms defined thereon, wherein each of the cap terminal position assurance mechanisms fixably mate with each of the plug terminal position assurance mechanisms, wherein each of the cap and plug terminal position assurance mechanisms comprise a post projecting outwardly from each of the cap member and the plug member, and a cutout configured to fixably mate to the post. The cutout maybe configured adjacent the post, wherein the cap/plug terminal position assurance mechanisms are arranged proximate an outer rim of the cap/plug member or the cap/plug terminal assurance mechanism may be located generally in the center of the interface manifold.

US Patent:

7534963, May 19, 2009

Filed:

Jan 10, 2008

Appl. No.:

11/972430

Inventors:

Ralph Sykes Martin - Mount Airy NC, US
Joseph Edward Geniac - Greensboro NC, US
Richard Speer - Kernersville NC, US
Michael Thomas Gromko - Greensboro NC, US

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01B 11/02

US Classification:

174113R, 174117 F

Abstract:

A low-profile cable is provided and includes a body having upper and lower portions that extend a length of the body and also having opposite sidewalls joining the upper and lower portions to one another. The cable also includes passages that are located between the sidewalls. The passages extend the length of the body and are configured to receive at least one twisted pair of conductors. Also, the cable includes a load-bearing structural section that spans between the upper and lower portions. The structural section includes opposing wall supports separated by a pocket channel therebetween. The structural section is configured to support the upper and lower portions and substantially resist deformation of the passages when external forces are induced onto at least one of the upper and lower portions.

US Patent:

7806721, Oct 5, 2010

Filed:

Jul 2, 2008

Appl. No.:

12/167031

Inventors:

Stephen Scott Herndon - Danville VA, US
Robert Jeffrey Burwell - Staley NC, US
Joseph Edward Geniac - Greensboro NC, US
Christine Anne Dooley - Lewisville NC, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H01R 13/60

US Classification:

4395401

Abstract:

A module assembly includes an interface module including a housing having a plurality of jack cavities and associated jack latch openings. The housing is configured to be mated with a patch panel. The module assembly also includes a plurality of modular jacks that are directly inserted into corresponding jack cavities. Each modular jack includes a single latch arm that engages the jack latch opening to retain the modular jack in the jack cavity. Optionally, each modular jack may include a top surface and a bottom surface, wherein the latch arm extends from the top surface and wherein the bottom surface is planar. The bottom surface may rest flush with a bottom wall of the jack cavity.

US Patent:

8546693, Oct 1, 2013

Filed:

Aug 4, 2010

Appl. No.:

12/850217

Inventors:

Michael Thomas Gromko - Greensboro NC, US
Joseph Edward Geniac - Greensboro NC, US
Keith Wayne Hoover - High Point NC, US
Ralph S. Martin - Mount Airy NC, US

Assignee:

Tyco Electronics Corporation - Berwyn PA

International Classification:

H01B 11/02

US Classification:

174113R

Abstract:

A cable includes twisted pairs of insulated conductors. Each twisted pair includes two insulated conductors twisted together in a helical manner. The twisted pairs are grouped together to define a central core of the cable. An inner filler element is wrapped helically around the twisted pairs of the central core. An outer filler element is wrapped helically around the twisted pairs of the central core. The outer filler element is wrapped over the inner filler element.

US Patent:

20090163058, Jun 25, 2009

Filed:

Dec 18, 2008

Appl. No.:

12/338465

Inventors:

Darrell Wayne Craig - Stokesdale NC, US
Christine Anne Dooley - Lewisville NC, US
Joseph E. Geniac - Greensboro NC, US

International Classification:

H01R 13/40

US Classification:

439147

Abstract:

An electrical connector assembly includes a connector having a housing and a receptacle for mating with a mating connector. The assembly also includes a cover configured to attach to the housing, and a tether linking the housing to the cover. The tether includes a housing mount for installing the tether onto the housing, a cover mount for installing the tether onto the cover, and a link connecting the housing mount to the cover mount. The link is non-metallic.

US Patent:

6511348, Jan 28, 2003

Filed:

Oct 19, 2001

Appl. No.:

10/041794

Inventors:

Thomas Wojtacki - Greensboro NC
Kevin J. Peterson - High Point NC
Kurt T. Zarbock - Advance NC
Joseph E. Geniac - Greensboro NC
William J. Remaley - Walkertown NC
Michael G. Pacyga - Clemmons NC

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

H01R 1366

US Classification:

439620, 439676, 4395415

Abstract:

The invention discloses a modular jack assembly comprised of an outer housing and a plurality of modular jack subassemblies. The modular jack subassemblies are comprised of an elongate beam support having a plurality of modular jack contacts on both sides thereof. The contacts extend into printed circuit board contacts and extend to and beyond the side edges of the elongate beam platform, leaving the space above and below the printed circuit board contacts and the beam support free, to accommodate signal conditioning componentry. Two printed circuit board modules are mounted orthogonally to the side edges of the beam support and include signal conditioning components. The assemblies are insertable into the housing defining modular jacks in the outer housing.

US Patent:

20230075555, Mar 9, 2023

Filed:

Oct 14, 2022

Appl. No.:

18/046756

Inventors:

- Greensboro NC, US
Jeffrey Miller - Allen TX, US
Joseph Edward Geniac - Greensboro NC, US
Rommel Quintero - High Point NC, US

International Classification:

H01L 23/00
H01L 23/31
H05K 1/14
H05K 3/40
H05K 1/02

Abstract:

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.