Joseph Yiu Lin

US Patent:

20220200232, Jun 23, 2022

Filed:

Mar 4, 2021

Appl. No.:

17/192470

Inventors:

- San Jose CA, US
Mitchell SRIMONGKOL - Elk Grove CA, US
Joseph LIN - San Jose CA, US

International Classification:

H01S 5/0234

Abstract:

In some implementations, an optical device for mounting in a flip-chip configuration includes a plurality of flip-chip bumps that are arranged in a pattern on the optical device, wherein the pattern is not aligned with a crystal cleavage plane associated with a substrate of the optical device. In some implementations, the optical device further includes a gap that separates a primary region of the optical device and a secondary region of the optical device, wherein at least one portion of a side of the gap is oriented at a non-zero angle to the crystal cleavage plane.