Joseph W Link

US Patent:

44411197, Apr 3, 1984

Filed:

Jan 15, 1981

Appl. No.:

6/273848

Inventors:

Joseph Link - Carrollton TX

Assignee:

Mostek Corporation - Carrollton TX

International Classification:

H01L 2302
H01L 3902
H02G 1308

US Classification:

357 74

Abstract:

An improved integrated circuit package (10) includes a cover (12), an intermediate subassembly (14) and a bottom subassembly (16). The intermediate and bottom subassemblies (14, 16) include lead frames (48, 22) respectively embedded therein, as well as openings which define a cavity for a semiconductor chip. The external lead pins (24) of the bottom subassembly (16) permit interconnection of the package with a circuit board or the like, while the external contacts (50) of the intermediate subassembly (14) cooperate with openings (62) in the cover to provide integral socket connections for other semiconductor packages or electrical components.

US Patent:

50557041, Oct 8, 1991

Filed:

Aug 4, 1989

Appl. No.:

7/389538

Inventors:

Joseph Link - Carrollton TX
Michael L. Bolan - Dallas TX
Allen H. Brunk - Carrollton TX
Paul E. Schneikart - Lewisville TX

Assignee:

SGS-Thomson Microelectronics, Inc. - Carrollton TX

International Classification:

H02J 900
H01L 23495

US Classification:

307 66

Abstract:

An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

US Patent:

43420699, Jul 27, 1982

Filed:

Feb 13, 1981

Appl. No.:

6/234400

Inventors:

Joseph Link - Carrollton TX

Assignee:

Mostek Corporation - Carrollton TX

International Classification:

H05K 114

US Classification:

361401

Abstract:

An integrated semiconductor package containing circuitry capable of supporting separately packaged semiconductors to achieve greater circuit board density and to allow separate semiconductor packages which cooperate with the supporting semiconductor package and die to be interchanged. The supporting die is interconnected electrically to lead pins and socket contacts using conductive circuitry compatible with the other semiconductor die. In a first embodiment corresponding metallization patterns are used to electrically interconnect an integrated circuit package to a conventional printed wiring board or ceramic wiring board containing socket contacts to receive lead pins from another integrated circuit package. A second embodiment is a unitized package containing integral socket contacts within the unitized integrated package to receive lead pins from another integrated circuit package.

US Patent:

52763544, Jan 4, 1994

Filed:

Mar 25, 1991

Appl. No.:

7/675074

Inventors:

Joseph Link - Carrollton TX
Michael L. Bolan - Dallas TX
Allen H. Brunk - Carrollton TX
Paul E. Schneikart - Lewisville TX

Assignee:

SGS-Thomson Microelectronics, Inc. - Carrollton TX

International Classification:

H02J 900
H01L 2348

US Classification:

307 66

Abstract:

An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).

US Patent:

49988883, Mar 12, 1991

Filed:

Mar 28, 1986

Appl. No.:

6/846510

Inventors:

Joseph Link - Carrollton TX
Michael L. Bolan - Dallas TX
Allen H. Brunk - Carrollton TX
Paul E. Schneikart - Lewisville TX

Assignee:

SGS-Thomson Microelectronics, Inc. - Carrollton TX

International Classification:

H01R 1300

US Classification:

439 73

Abstract:

An integrated circuit, typically a random access memory, is housed in a package (14). In the application associated with the integrated circuit it is desired to maintain the data states stored in the memory even when the normal supply voltage is disconnected from the package (14). Batteries (24, 26) are secured in recesses (20, 22) within a structure (12) which is connected to the integrated circuit package (14). A top spring clip (100) is provided to securely hold the batteries (24, 26) within the recesses (20, 22) and forms a common conductor in contact with the upper terminal of both batteries. A bottom spring clip (74, 76) is provided for each of the recesses (20, 22) to form separate conductors in contact with the lower terminal of each battery. The batteries can be readily inserted and removed over lips (64, 70) in the recess (20, 22).