Joseph Philip Lutfy

US Patent:

44459793, May 1, 1984

Filed:

Aug 4, 1983

Appl. No.:

6/520477

Inventors:

Joseph P. Lutfy - Highland MI
Thaddeus J. Grabowski - Taylor MI
Robert G. Arnold - Rochester MI

Assignee:

General Motors Corporation - Detroit MI

International Classification:

C25D 502
C25D 556

US Classification:

204 15

Abstract:

A process for providing a dielectric substrate with a composite surface comprising a metal plated portion side-by-side an unplated portion. The process includes: depositing a metallic film over the surface of the substrate; removing a narrow band of the film to electrically isolate one portion of the film from another; immersing the substrate in an electroplating bath capable of dissolving the film; cathodizing one of the film portions in the bath to electroplate that portion while the other portion dissolves therein to expose the underlying substrate. The thusly exposed substrate may subsequently be painted.

US Patent:

44862733, Dec 4, 1984

Filed:

Aug 4, 1983

Appl. No.:

6/520478

Inventors:

Joseph P. Lutfy - Highland MI
Thaddeus J. Grabowski - Taylor MI
Robert G. Arnold - Rochester MI

Assignee:

General Motors Corporation - Detroit MI

International Classification:

C25D 502
C25D 554
C25D 534

US Classification:

204 15

Abstract:

Process for the maskless electroplating of selective areas of a dielectric substrate comprising depositing an electroconductive film on the surface, evaporating a narrow band of the film off the surface to expose a narrow strip of substrate surrounding a zone of the film where electroplating is unwanted, immersing the substrate in an electroplating bath opposite an appropriate anode, and cathodizing only that portion of the film that covers the region sought to be plated. In one embodiment a laser beam is used to selectively evaporate electroless copper from the surface of an ABS substrate.