Joseph A Schultz

US Patent:

7113761, Sep 26, 2006

Filed:

Oct 7, 2003

Appl. No.:

10/680836

Inventors:

Richard S. Bickham - Cary IL, US
Joseph Schultz - Wheaton IL, US
Dale Anderson - Colleyville TX, US
Mark Van Horn - Arlington TX, US

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04B 1/28

US Classification:

455333, 4551512, 4555561

Abstract:

RF power device module () having an RF power device chip () which integrates an RF power device () with at least one of DC detector circuits (), RF detector circuits (), and thermal detector circuit () which cooperate with optical emitter/detector components () that supports a bi-directional optical link () made through free space with diagnostic processing and control circuits implemented on a separate chip () mounted within the same enclosure (). The bi-directional optical link () enables interpretation of detection signals () received from the RF power device chip () and the feed back of default or other management and control signals () sent back to the RF power device chip () in response to the detected and analyzed conditions. The RF power device module () can be used in RF power transistors, such used in a base station, or mobile or portable transmitters, used in telecommunications, or in RF power amplifiers and instrumentation amplifiers in general.

US Patent:

20070075780, Apr 5, 2007

Filed:

Oct 5, 2005

Appl. No.:

11/215661

Inventors:

Enver Krvavac - Lake Zurich IL, US
Joseph Schultz - Wheaton IL, US
Yinglei Yu - Tempe AZ, US

International Classification:

H03F 3/68

US Classification:

330295000

Abstract:

An apparatus and method for adaptive biasing of a Doherty amplifier () is disclosed. The apparatus includes a carrier amplifier (), a peaking amplifier (), a carrier amplifier bias circuit () and a peaking amplifier bias circuit (), all integrated onto a single chip. The method includes dividing an input signal into an in-phase signal and a quadrature phase signal. The method further includes sampling the input signal and applying the sampled signal to the biasing circuits. The method further includes adaptively biasing the carrier amplifier and the peaking amplifier by the output of the biasing circuits.

US Patent:

20080251416, Oct 16, 2008

Filed:

Apr 16, 2007

Appl. No.:

11/735655

Inventors:

Debra L. Delany - Cary IL, US
Robert J. Peterson - Crystal Lake IL, US
Joseph L. Schultz - Madison WI, US
Daniel Hyun-Jae Shin - Chicago IL, US

International Classification:

B65D 5/52

US Classification:

206736

Abstract:

A package is provided for dispensing a plurality of consumable products. The package may comprise a lid and a body defining a container interior and a sidewall. The lid and the body may define a hook at a top portion of the package for receiving a display hanger. The lid and the body may also define a surface at a bottom portion of the package for standing the package on its sidewall. In an embodiment, the package may define a circular or oval shape. The body can be used as a serving dish to display a plurality of consumable products therein.

US Patent:

55304389, Jun 25, 1996

Filed:

Jan 9, 1995

Appl. No.:

8/370276

Inventors:

Richard S. Bickham - Cary IL
Robert W. Furtaw - Lake Zurich IL
Joseph G. Schultz - Bartlett IL
Arun Sobti - South Barrington IL
Kenneth J. Zdunek - Schaumburg IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

G08B 522

US Classification:

340825340

Abstract:

A radio system user (126) is alerted (129) as to the occurrence of a financial transaction by a customer (118). Data (122) is obtained from the customer (118) and used to identify a radio system user (126), who is authorized to conduct the financial transaction. A message, indicative of the financial transaction, is automatically provided to a radio system and broadcast (129) to the radio system user (126), thereby alerting the user (126) to the financial transaction.

US Patent:

55613950, Oct 1, 1996

Filed:

Jan 27, 1995

Appl. No.:

8/379707

Inventors:

John R. Melton - Bolingbrook IL
Joseph G. Schultz - Bartlett IL
Terence E. Sumner - Hanover Park IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H03F 368
H03G 320

US Classification:

330 2

Abstract:

A method and apparatus (100) is for providing self adjustment of a multistage radio frequency power amplifier (RFPA) (200). The apparatus (100) includes a transmit input stage (150) and a controller (110). Included in the multistage RFPA (200) are N RFPA stages (201) coupled in parallel to an N-way RF splitter (210) and to an N-way RF combiner (220), and a power sense stage (225) which generates a forward power sense signal (167). Each of the N RFPA stages (210) includes an adjustable power amplifier (PA) (300). The controller (110) optimizes a gain match and a phase match of the multistage RFPA (200) by adjusting signals which are coupled to each adjustable PA (300). The adjustments are made in response to the forward power sense signal (167) while the controller (110) controls the test input stage (150) which generates a predetermined test signal (155).

US Patent:

20220182023, Jun 9, 2022

Filed:

May 28, 2021

Appl. No.:

17/333280

Inventors:

- Austin TX, US
Joseph Gerard Schultz - Wheaton IL, US
Kimberly Foxx - Phoenix AZ, US

International Classification:

H03F 3/195
H03F 3/24
H03F 1/56
H03F 1/02
H03F 1/52
H01L 23/66

Abstract:

An amplifier includes a semiconductor die and a substrate that is distinct from the semiconductor die. The semiconductor die includes a first RF signal input terminal, a first RF signal output terminal, and a transistor. The transistor has a control terminal electrically coupled to the first RF signal input terminal, and a current-carrying terminal electrically coupled to the first RF signal output terminal. The substrate includes a second RF signal input terminal, a second RF signal output terminal, circuitry coupled between the second RF signal input terminal and the second RF signal output terminal, and an electrostatic discharge (ESD) protection circuit. The amplifier also includes a connection electrically coupled between the ESD protection circuit and the control terminal of the transistor. The substrate may be another semiconductor die (e.g., with a driver transistor and/or impedance matching circuitry) or an integrated passive device.

US Patent:

20190379334, Dec 12, 2019

Filed:

Jun 11, 2018

Appl. No.:

16/004553

Inventors:

- AUSTIN TX, US
JOSEPH GERARD SCHULTZ - WHEATON IL, US
YU-TING DAVID WU - SCHAUMBURG IL, US
NICK YANG - WILMETTE IL, US

International Classification:

H03F 1/02
H03F 3/213
H03F 3/195
H05K 1/02
H01P 3/08
H05K 1/18
H03F 1/56

Abstract:

An amplifier module is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die is mounted at a top surface of the multi-layer PCB. A second power transistor die is mounted at the top surface of the multi-layer PCB. An impedance inversion element is coupled between an output of the first power transistor die and an output of the second power transistor die. A combining node is formed at the output of the second power transistor die. A stub circuit including a transmission line element is coupled at the combining node.

US Patent:

20190173430, Jun 6, 2019

Filed:

Dec 4, 2017

Appl. No.:

15/830477

Inventors:

- Austin TX, US
Nick Yang - Wilmette IL, US
Joseph Gerard Schultz - Wheaton IL, US
Enver Krvavac - Kildeer IL, US
Yu-Ting David Wu - Schaumburg IL, US

International Classification:

H03F 1/02
H03F 3/195
H03F 3/60

Abstract:

Embodiments of a multiple-path amplifier (e.g., a Doherty amplifier) and a module housing the amplifier include a first amplifier (or first power transistor die) with a first output terminal, a second amplifier (or second power transistor die) with a second output terminal, and an impedance inverter line assembly electrically connected between the first and second output terminals. The impedance inverter line assembly includes a first transmission line and a surface mount component connected in series between the first and second output terminals. In various embodiments, the surface mount component is selected from a fixed-value capacitor, a fixed-value inductor, a tunable capacitor, a tunable inductor, and a tunable passive component network.