Joseph Anthony Simon

US Patent:

6609952, Aug 26, 2003

Filed:

Mar 29, 2002

Appl. No.:

10/109902

Inventors:

Joseph P. Simon - Newark CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 4900

US Classification:

451 6, 451 8, 451287, 451296

Abstract:

In a method for determining an endpoint in a chemical mechanical planarization (CMP) operation, the concentration of an oxidizing agent in the slurry byproduct generated during the CMP operation is monitored. The endpoint of the CMP operation is determined based on the concentration of the oxidizing agent in the slurry byproduct. The concentration of the oxidizing agent in the slurry byproduct may be monitored by diverting the slurry byproduct from a surface of a polishing pad, and measuring an optical property of the slurry byproduct diverted from the surface of the polishing pad. A CMP system configured to implement the method for determining an endpoint also is described.

US Patent:

6749483, Jun 15, 2004

Filed:

May 5, 2003

Appl. No.:

10/430611

Inventors:

Joseph P. Simon - Newark CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 4900

US Classification:

451 6, 451 8

Abstract:

In a method for determining an endpoint in a chemical mechanical planarization (CMP) operation, the concentration of an oxidizing agent in the slurry byproduct generated during the CMP operation is monitored. The endpoint of the CMP operation is determined based on the concentration of the oxidizing agent in the slurry byproduct. The concentration of the oxidizing agent in the slurry byproduct may be monitored by diverting the slurry byproduct from a surface of a polishing pad, and measuring an optical property of the slurry byproduct diverted from the surface of the polishing pad. A CMP system configured to implement the method for determining an endpoint also is described.

US Patent:

6896586, May 24, 2005

Filed:

Mar 29, 2002

Appl. No.:

10/112628

Inventors:

Xuyen Pham - Fremont CA, US
Tuan Nguyen - San Jose CA, US
Ren Zhou - Fremont CA, US
David Wei - Fremont CA, US
Linda Jiang - Milpitas CA, US
Joseph P. Simon - Newark CA, US
Tony Luong - San Jose CA, US
Sridharan Srivatsan - Sunnyvale CA, US
Anjun Jerry Jin - Milpitas CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B049/00

US Classification:

451 7, 451 8, 451 53

Abstract:

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.