Joseph P Sousa

US Patent:

20230094483, Mar 30, 2023

Filed:

Sep 23, 2022

Appl. No.:

17/951429

Inventors:

- Billerica MA, US
Joseph SOUSA - Lakeville MA, US
Elango Balu - North Reading MA, US
Laundy Oeur - Lowell MA, US
Ajoy ZUTSHI - Fremont CA, US

International Classification:

B24B 53/017
B24B 37/16
B24B 37/14

Abstract:

A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing plate having at least one of a magnetic property, a color property, a structural property, or any combination thereof. The CMP pad conditioner assembly includes a plurality of segments including a ceramic substrate and a plurality of laser textured protrusions integral with the ceramic substrate. The plurality of laser textured protrusions is coated with a conformal diamond layer.