G.r.i.t Athletics
Athletic Coach
Ecg May 2006 - Aug 2012
Owner
United States Postal Service May 2005 - Dec 2005
Collections
Education:
University of Colorado Boulder 2001 - 2003
Nassau Community College
Skills:
Business Planning Strategic Planning Customer Service Business Strategy Entrepreneurship Negotiation Public Speaking Team Building Financial Analysis Managerial Finance New Business Development Project Planning Management Consulting Team Leadership Small Business Leadership Nonprofits Social Media Marketing Start Ups Business Development Event Planning Management
Feb 2013 to 2000 Driver/Freight HandlerHealthy Choice Healthcare Plano, TX Dec 2009 to Nov 2012 Home Health Care WorkerPerformance Food Group Elkton, MD 2003 to 2010 Truck DriverBurris Logistics Elkton, MD Oct 2005 to Nov 2009 Truck DriverSchindler Elevator Company New Castle, DE 1991 to 2004 Material HandlerDade Berring Refrigeration New Castle, DE Dec 2000 to 2003 Fork Lift DriverSchneider National Inc
Nov 1998 to Dec 2000 DriverYellow Freight Preston, MD May 1997 to Nov 1997 Dock / Driver
Apr 2013 to 2000 Vineyard LaborerSwift Family Photography
Jan 2011 to 2000 OwnerCleanworks Janitorial Newark, DE Nov 2008 to Jul 2010 Floor TechnicianExcellent Choice Group
Jun 2006 to Jul 2010 OwnerTatnall College Preparatory School Wilmington, DE Jan 2008 to May 2009 Sprint Track CoachSelf Employed Wilmington, DE Jan 2006 to Sep 2008 Speed CoachUS Postal Service Newark, DE May 2005 to Dec 2005 Carrier/Collections
Education:
University of Colorado Boulder, CO 2001 to 2002 Bachelor in Ethnic StudiesNassau Community College Hempstead Hempstead, NY 1999 to 2001 Associate in General Studies
Us Patents
Electromechanical Device Having A Plurality Of Bundles Of Fibers For Interconnecting Two Planar Surfaces
Michael G. Pecht - Hyattsville MD, US Joseph A. Swift - Ontario NY, US Stanley J. Wallace - Victor NY, US Yuliang Deng - Greenbelt MD, US
Assignee:
Xerox Corporation - Stamford CT
International Classification:
H01R 12/00 H05K 1/00
US Classification:
439 65
Abstract:
According to various embodiments, exemplary interconnects and methods for interconnection are provided that can include contacts formed by fiber bundles. The exemplary interconnects can be used to form separable or non-separable electro-mechanical connections between one or more of the generally accepted six levels of interconnection. In various embodiments, the exemplary interconnects can allow management of the thermal properties of the electronic devices. Exemplary interconnects can also provided reduced thickness allowing redundancy and additional compliance as desired.