Julie C Campbell

US Patent:

7378832, May 27, 2008

Filed:

Aug 22, 2006

Appl. No.:

11/508583

Inventors:

Albert Sutono - San Jose CA, US
Julie Campbell - Beaverton OR, US
Lawrence Jacobs - Beaverton OR, US
Yigal Shaul - Cupertino CA, US

Assignee:

LeCroy Corporation - Chestnut Ridge NY

International Classification:

G01R 23/00
G01R 31/02
H04B 15/00

US Classification:

324 7619, 324754, 702191

Abstract:

Apparatus and associated systems and methods may relate to a wide bandwidth cable assembly that may include an active amplification stage to receive high frequency signals (e. g. , 1 GHz or above) through a transmission line extending distally to a passive, high density signal probe stage. In an illustrative example, the probe stage may receive multiple analog or digital signals from a device under test (DUT). In some embodiments, the probe stage may include probe pins with integrated series resistance to control signal loading, and an equalizer to shape the signal path's frequency response. The amplification stage may provide a virtual ground reference for a termination impedance that may match the transmission line's impedance and may connect in series with a feedback impedance. In one example, a minimally invasive probe head may facilitate measurement of multiple channels of a high speed data bus with minimal signal distortion and/or attenuation.