Young Joon Kim - Greenfield MA, US Jun Hong Yi - Greenfield MA, US James E. Zellmann - Montague MA, US
Assignee:
Judd Wire, Inc. - Turners Falls MA
International Classification:
H01B 7/00
US Classification:
174110R
Abstract:
Lightweight composite electrical conductors made up of a plastic matrix or plastic core, a plurality of electrical conductors either embedded within the plastic matrix or circumferentially surrounding an outer surface of the plastic core, and at least one insulating layer, as well as, cables incorporating one or more of these conductors, are provided. The inventive composite conductors and cables are particularly useful for automotive and aircraft wire and cable.
Mark A. Anderson - Holyoke MA, US Jeffrey S. Doak - Greenfield MA, US George Gong - Rindge NH, US Young Joon Kim - Greenfield MA, US Jun Hong Yi - Greenfield MA, US
Assignee:
Judd Wire, Inc. - Turners Falls MA
International Classification:
G02B 6/44
US Classification:
385100, 385126, 385128, 385113
Abstract:
A low smoke, low toxicity fiber optic cable that provides an intermediate surface that facilitates bonding to optical connectors such as LC connectors, is provided. In a preferred embodiment, the inventive cable exhibits improved dimensional stability by minimizing or eliminating shrinkage stress on the optic fiber core.
Method And Apparatus For Measuring Ac Shield Continuity For Shielded Twisted Pair Structured Datacomm Cable Link
Jeffrey Sandsmark Bottman - Seattle WA, US Jun Ho Yi - Bothell WA, US
Assignee:
Fluke Corporation - Everett WA
International Classification:
G01R 27/28 G01R 31/08 H01H 31/02
US Classification:
324627, 324527, 324555
Abstract:
AC shield continuity for shielded twisted pair structured datacomm cable is determined by testing the cable, driven in a common mode, over a range of frequencies, to determine presence and location of shield breaks. DC ground path generated false results are thereby avoided.
Multi-Layer Insulation System For Electrical Conductors
Young Kim - Greenfield MA, US Zeng Wan - Greenfield MA, US Jun Yi - Greenfield MA, US
International Classification:
H01B017/00
US Classification:
174/14900R
Abstract:
A multi-layer insulation system for electrical conductors, an insulated electrical conductor, a process for preparing an insulated conductor, and an insulated conductor prepared by such a process are provided. The insulated electrical conductors are lightweight, qualify for temperature ratings of up to approximately 230 C., and demonstrate mechanical durability and hydrolysis resistance. As such, these insulated conductors are particularly useful for aircraft wire and cable.
Jan 2014 to 2000 Field Application EngineerChomper Seattle, WA Mar 2012 to Jan 2014 Electrical EngineerMicrosoft Redmond, WA Nov 2012 to Jul 2013 Hardware Engineer (Contractor)Fluke Networks Everett, WA Jan 2006 to Mar 2012 R&D Electrical EngineerCeton Corporation Kirkland, WA 2006 to 2007 Lead Electrical Engineer
Education:
University of Washington Seattle, WA 2009 MS in Electrical EngineeringUniversity of Washington Seattle, WA 2005 BS in Electrical Engineering
University of Washington Seattle, WA Mar 2011 to Jun 2011 Persistence-of-Vision Display, Final ProjectUniversity of Washington Seattle, WA Jan 2011 to Mar 2011 WREL Project, Research AssistantUniversity of Washington Seattle, WA Jan 2011 to Mar 2011 A.R. Drone Controller Design, Final ProjectUniversity of Washington Seattle, WA Sep 2010 to Mar 2011 ATLAS Simulation, Research AssistantUniversity of Washington Seattle, WA Sep 2010 to Dec 2010 Microprocessor Design, Final ProjectUniversity of Washington Seattle, WA Jun 2010 to Dec 2010 Eta Kappa Nu (HKN), Tutor & MemberUniversity of Washington Seattle, WA Jun 2010 to Aug 2010 Video Game Development, Final ProjectMagic Toyota Edmonds, WA Sep 2005 to Jan 2008 Toyota Automotive Technician
Education:
University of Washington Seattle, WA Jan 2009 to Jan 2011 BS in Electrical EngineeringShoreline Community College Shoreline, WA Jan 2008 to Jan 2009 AS in Engineering
Skills:
MATLAB, Verilog, Java, C, PSpice, SolidWorks, ATLAS, Altera DE1 Board, PIC Microprocessor, MAKE Controller, Array Logic Devices