Karl D Conrad

US Patent:

20070090150, Apr 26, 2007

Filed:

Oct 26, 2005

Appl. No.:

11/260016

Inventors:

Karl Conrad - Rocklin CA, US
Gregg Meyer - Roseville CA, US

International Classification:

B23K 5/00
B23K 1/00
B23K 5/22

US Classification:

228006200, 228006100, 228212000

Abstract:

A component handling device is disclosed. The component handling device includes a body with a component receiving portion that has a front region defining a first opening and a rear region defining a second opening. Also, the component receiving portion includes a component encasing wall extending from the first opening to the second opening. Additionally, a component elevating feature configured to assist with detaching the component from a substrate is coupled to the interior surface of the component encasing wall. In addition, a user gripping feature is coupled to the body of the component handling device. Moreover, a component bounding feature proximate to the second opening is coupled to the body to prevent the component from moving past the second opening. Furthermore, a component retaining feature is coupled to the interior surface of the component encasing wall for retaining the component when the component is placed within the component handling device.

US Patent:

20080264663, Oct 30, 2008

Filed:

Apr 27, 2007

Appl. No.:

11/741256

Inventors:

Gregory S. Meyer - Roseville CA, US
Karl Conrad - Rocklin CA, US

International Classification:

H01B 7/29

US Classification:

174 36, 29825

Abstract:

An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.