Keith R Guetig

US Patent:

20130004120, Jan 3, 2013

Filed:

Jun 29, 2012

Appl. No.:

13/539173

Inventors:

Eric ZBINDEN - Sunnyvale CA, US
Randall MUSSER - Enola PA, US
Jean-Marc André VERDIELL - Palo Alto CA, US
John MONGOLD - Middletown PA, US
Brian VICICH - Prospect KY, US
Keith GUETIG - Louisville KY, US

Assignee:

SAMTEC, INC. - New Albany IN

International Classification:

G02B 6/12

US Classification:

385 14

Abstract:

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

US Patent:

20130148973, Jun 13, 2013

Filed:

Feb 4, 2013

Appl. No.:

13/758464

Inventors:

Randall MUSSER - Enola PA, US
Jean-Marc André VERDIELL - Palo Alto CA, US
John MONGOLD - Middletown PA, US
Brian VICICH - Prospect KY, US
Keith GUETIG - Louisville KY, US

Assignee:

SAMTEC, INC. - New Albany IN

International Classification:

H04B 10/40
H04B 1/38

US Classification:

398115, 375219

Abstract:

An interconnect system including a host circuit board; an IC package connected to the host circuit board and including a first connector, an IC circuit board, and an IC die; and a transceiver arranged to mate with the first connector so that at least some electrical signals transmitted to and from the IC die are transmitted only on or through the IC circuit board.

US Patent:

20130236186, Sep 12, 2013

Filed:

May 16, 2013

Appl. No.:

13/895571

Inventors:

Randall MUSSER - Enola PA, US
Jean-Marc André VERDIELL - Palo Alto CA, US
John MONGOLD - Middletown PA, US
Brian VICICH - Prospect KY, US
Keith GUETIG - Louisville KY, US

Assignee:

SAMTEC, INC. - New Albany IN

International Classification:

H04B 10/40

US Classification:

398115, 375219

Abstract:

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

US Patent:

20130303025, Nov 14, 2013

Filed:

Jul 25, 2013

Appl. No.:

13/950628

Inventors:

Keith Richard GUETIG - Louisville KY, US
Dale Francis SCHMELZ - Depauw IN, US
Randall Eugene MUSSER - Enola PA, US
John Allen MONGOLD - Middletown PA, US

International Classification:

H01R 12/70
H01R 43/26

US Classification:

43962021, 29843

Abstract:

A transceiver for a two-connector system includes a circuit board, at least one cable attached to the circuit board, and a housing arranged to contain the circuit board. The two-connector system includes a front connector and a back connector. When the transceiver is connected to the two-connector system, a front edge of the circuit board is arranged to engage with the front connector and an intermediate portion of the circuit board is arranged to engage with the back connector.

US Patent:

20130312992, Nov 28, 2013

Filed:

May 24, 2012

Appl. No.:

13/479521

Inventors:

Keith GUETIG - Louisville KY, US
Shashi CHUGANEY - Milwaukie OR, US
Travis ELLIS - Portland OR, US
Eric KORFF - Jeffersonville IN, US

Assignee:

SAMTEC INC. - New Albany IN

International Classification:

H01B 11/06

US Classification:

174 34

Abstract:

A cable ribbon includes a first and second twinaxial cables and an outer layer surrounding the first and second twinaxial cables. The first twinaxial cable includes two first wires that are parallel or substantially parallel to each other along a longitudinal axis of the twinaxial cable ribbon, a first insulator surrounding each of the two first wires along the longitudinal axis, and a first conductive shield surrounding the first insulator along the longitudinal axis. The second twinaxial cable includes two second wires that are parallel or substantially parallel to each other along the longitudinal axis, a second insulator surrounding each of the two second wires along the longitudinal axis, and a second conductive shield surrounding the second insulator along the longitudinal axis. The first and second conductive shields are in direct contact with each other.

US Patent:

20210151914, May 20, 2021

Filed:

Dec 18, 2020

Appl. No.:

17/126117

Inventors:

- New Albany IN, US
Keith Guetig - Louisville KY, US

International Classification:

H01R 12/59
H01R 12/70
H01R 12/71
H01R 12/85
H01R 13/6471
H01R 43/20

Abstract:

An electrical connector includes electrical contacts that are configured to be mounted to an electrical cable, and mating ends that are configured to be surface mounted to a contact pad of an underlying substrate, such that the mating ends flex and apply a pressure against the contact pad.

US Patent:

20210045244, Feb 11, 2021

Filed:

Mar 15, 2019

Appl. No.:

16/965135

Inventors:

- New Albany IN, US
Keith R. GUETIG - New Albany IN, US
Jignesh H. SHAH - New Albany IN, US

International Classification:

H05K 1/14
H05K 1/11

Abstract:

A printed circuit board (PCB) assembly includes a first PCB, a high-speed PCB, and a high-speed interconnect electrically and physically connecting the first PCB and the high-speed PCB.

US Patent:

20200403334, Dec 24, 2020

Filed:

Aug 15, 2017

Appl. No.:

16/325456

Inventors:

- New Albany IN, US
Eric ZBINDEN - Santa Clara CA, US
Keith GUETIG - Louisville KY, US
Jignesh H. SHAH - New Albany IN, US
Jean Carlo WILLIAMS BARNETT - New Albany IN, US
Chadrick Paul FAITH - Corydon IN, US
R. Brad BETTMAN - Mountain View CA, US

International Classification:

H01R 12/70
H01R 12/77
H01R 12/83
H01R 13/639
G02B 6/42

Abstract:

An interconnect system includes various anti-backout latches that are movable between an engaged position and a disengaged position. When in the engaged position, the anti-backout latches can be configured to prevent an interconnect module, such as an optical transceiver, from becoming unmated from a host module. When in the disengaged position, the anti-backout latches permit the interconnect module to become unmated from a host module. Securement members are also disclosed that secure a heat sink to a module housing of the interconnect module.