Keith E Sharp

US Patent:

20160363389, Dec 15, 2016

Filed:

May 23, 2016

Appl. No.:

15/161945

Inventors:

- Baltimore MD, US
- Huntersville NC, US
Stephen Ryan - Towson MD, US
Longyu Zhao - Baltimore MD, US
Seunghyun Ha - Nam-gu Busan, KR
Yong Zhang - Baltimore MD, US
Sen Lin - Baltimore MD, US
James K. Guest - Lutherville Timonium MD, US
Keith Sharp - Huntersville NC, US

International Classification:

F28F 3/02
F28F 21/08

Abstract:

The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.