Kenneth M Bates

US Patent:

57870497, Jul 28, 1998

Filed:

Nov 7, 1995

Appl. No.:

8/554859

Inventors:

Kenneth N. Bates - Eugene OR

International Classification:

G03B 4206
G01N 2900

US Classification:

367 7

Abstract:

An acoustic imaging apparatus and method that achieves desired delays with coded signals. Linear, curved linear and sector scanning is provided in 1-D arrays and planar, curved planar and sector scanning is provided in 2-D arrays. Composite and non-linear implementations are presented. Dynamic and discrete dynamic focusing is disclosed for the relevant arrays. The 2-D array makes possible 3-D imaging.

US Patent:

50990900, Mar 24, 1992

Filed:

Jan 11, 1990

Appl. No.:

7/460980

Inventors:

G. Graham Allan - Seattle WA
Gary A. DeBardi - Bellvue WA
Amar N. Neogi - Seattle WA
Kenneth N. Bates - Eugene OR
Robert B. Erley - Woodinville WA
Thomas L. Jacobs - Lynnwood WA
Ramzi F. Hamade - Sunnyvale CA
Stephen J. Horne - El Granada CA
Manu C. Patel - Sunnyvale CA
John E. Rose - Half Moon Bay CA
Mark S. Schlosser - Seattle WA
David P. Warden - Belmont CA

Assignee:

Ariel Electronics, Inc. - Sunnyvale CA

International Classification:

H05K 100
B28B 722
B23B 1900

US Classification:

174257

Abstract:

An apparatus and method are disclosed for preparing electrically conductive traces on a circuit board using an additive technology. The traces are directly written in a serial process with each trace being able to be individually insulated. The apparatus includes an extrusion element for extruding a first material and a stage. The stage is for holding the extrusion element and the circuit board in relative proximity and for producing relative motion between the extrusion element and the circuit board in order to extrude the first material onto the surface of the circuit board along preselected paths to produce the electrically conductive traces. According to the method of invention, a first polymerizable material is extruded onto a circuit substrate support along preselected paths to form traces, and the first polymerizable material is polymerized, the first polymerizable material being conductive after polymerization. A circuit board for holding electrical components is disclosed which includes a circuit substrate support and a plurality of electrically conductive traces. The traces are adhered to the circuit substrate support between locations for the electrical components, the traces being formed of a polymer thick film by extrusion from an orifice onto the support along paths defining the location of the traces.