Kenneth Barry Cole

US Patent:

20020066726, Jun 6, 2002

Filed:

Jul 6, 2001

Appl. No.:

09/900285

Inventors:

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

International Classification:

H05B003/68

US Classification:

219/444100

Abstract:

A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. In another aspect, the chuck of the invention provides for interchangeable top surface assemblies used to support the workpiece chuck. The thermal plate assembly includes mechanical mounting for the top surface assembly. The mounting is adapted to accept different types of top surface assemblies, depending on the application in which the chuck is being used. The interchangeable nature of the top surface assemblies permits the user to use multiple top surfaces with a single thermal plate. In another aspect of the invention, the negative effects of movements between chuck layers can be mitigated by applying a hard coating such as a hard anodize to one of the surfaces between the top surface assembly and the thermal plate assembly.

US Patent:

20030213793, Nov 20, 2003

Filed:

Jun 19, 2003

Appl. No.:

10/465716

Inventors:

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

International Classification:

H05B003/68

US Classification:

219/444100, 219/544000

Abstract:

A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. In another aspect, the chuck of the invention provides for interchangeable top surface assemblies used to support the workpiece chuck. The thermal plate assembly includes mechanical mounting for the top surface assembly. The mounting is adapted to accept different types of top surface assemblies, depending on the application in which the chuck is being used. The interchangeable nature of the top surface assemblies permits the user to use multiple top surfaces with a single thermal plate. In another aspect of the invention, the negative effects of movements between chuck layers can be mitigated by applying a hard coating such as a hard anodize to one of the surfaces between the top surface assembly and the thermal plate assembly.

US Patent:

20050121186, Jun 9, 2005

Filed:

Nov 23, 2004

Appl. No.:

10/997017

Inventors:

Douglas Hudson - Hopkinton MA, US
James Pelrin - Taunton MA, US
Sanjiv Patel - Bellingham MA, US
Chin Chien Tee - Banting Senagor D.E., MY
Kenneth Cole - Holliston MA, US

International Classification:

F28F007/00
F25B029/00

US Classification:

165253000, 165260000

Abstract:

A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow rate technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate. When the temperature of the chuck is being maintained at a set point temperature, the flow rate of the fluid can be reduced such that electrical noise introduced by the motion of the fluid, such as by the triboelectric effect, can be reduced. A capillary tube can be connected between the first fluid carrying path and the second fluid carrying path. First and second valves can be connected in the first and second fluid carrying paths to prevent the flow of fluid into the chuck when the chuck is at high temperature such that motion induced by flash boiling of the fluid is eliminated.

US Patent:

20050217583, Oct 6, 2005

Filed:

Jun 7, 2005

Appl. No.:

11/146959

Inventors:

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

International Classification:

C23C016/00

US Classification:

118724000, 156345270, 156345520, 156345530

Abstract:

A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

US Patent:

20070240448, Oct 18, 2007

Filed:

Mar 13, 2007

Appl. No.:

11/717432

Inventors:

Kenneth Cole - Holliston MA, US
Michael Conroy - Attleboro MA, US
Edward Lowerre - Brooklyn NY, US
James Pelrin - Taunton MA, US

Assignee:

Temptronic Corporation - Sharon MA

International Classification:

F25D 9/00

US Classification:

062440000

Abstract:

A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

US Patent:

20150336790, Nov 26, 2015

Filed:

Mar 27, 2015

Appl. No.:

14/670829

Inventors:

- Norwood MA, US
George M. Molnar - Westford MA, US
Gregory S. Davis - Woburn MA, US
Bruce Ma - Methuen MA, US
Kenneth J. Cole - Somerville MA, US
James Timony - North Andover MA, US
Kenneth Flanders - Reading MA, US

International Classification:

B81B 3/00
B81C 1/00

Abstract:

Thick (i.e., greater than two microns), fine-grained, low-stress tungsten MEMS structures are fabricated at low temperatures, particularly for so-called “MEMS last” fabrication processes (e.g., when MEMS structures are fabricated after electronic circuitry is fabricated). Means for very accurately etching structural details from the deposited tungsten layer and for strongly and stably anchoring the tungsten layer to an underlying substrate are disclosed. Also, means for removing a sacrificial layer underlying the mobile tungsten layer without damaging the tungsten or allowing it to be drawn down and stuck by surface tension is disclosed.