Kenneth Lee Cook

US Patent:

54186889, May 23, 1995

Filed:

Mar 29, 1993

Appl. No.:

8/038423

Inventors:

Allen D. Hertz - Boca Raton FL
David A. Tribbey - Boynton Beach FL
Kenneth Cook - Lake Worth FL
Arthur L. A. Baker - Greenacres FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 114

US Classification:

361790

Abstract:

An electronic device (100) comprises a first substrate (102) having a first circuit pattern disposed thereon which is selectively processed to provide pretinned connection pads (108, 116, 124, 132, 140) for connection to at least one electronic component (142) and a second circuit pattern disposed on a second substrate (104). The second circuit pattern disposed on the second substrate (104) is selectively processed to further provide pretinned connection pads (110, 118, 126) for connection to the first circuit pattern, and the second substrate (104) further has relief provided within a portion thereof to position the at least one electronic component (142) with respect to the pretinned connection pads (108, 116, 124, 132, 140) on the first circuit pattern. The pretinned connection pads (108, 116, 124, 132, 140, 110, 118, 126) are processed using a low residue fluxing agent to enable processing of the first (102) and second (104) substrates and the at least one electronic component (142) in a single operation through an envelope heating device without a requirement for cleaning after reflow.

Address:

1839 Middle Riv Dr APT 403, Ft Lauderdale, FL 33305

VIN:

WDBRF52J77F859472

Make:

MERCEDES-BENZ

Model:

C-CLASS

Year:

2007