Kenneth C Cook

US Patent:

53298705, Jul 19, 1994

Filed:

Sep 9, 1991

Appl. No.:

7/758476

Inventors:

Kenneth E. Cook - Lake Worth FL

International Classification:

B63B 128

US Classification:

114280

Abstract:

A watercraft employs three or more supercavitating hydrofoils. The elements that connect the hydrofoils to the hull may flex to thus raise or lower the hydrofoils relative to the hull. The relative motion between the hydrofoils and the hull is dampened by shock absorbers or the like. A control system operated by the pilot may apply forces tending to raise or lower the hydrofoils relative to the hull. The stern hydrofoil is mounted on a support that also carries a power driven propeller and a rudder.

US Patent:

51591715, Oct 27, 1992

Filed:

Sep 3, 1991

Appl. No.:

7/753540

Inventors:

Kenneth E. Cook - Lake Worth FL
Allen D. Hertz - Boca Raton FL
David A. Tribbey - Boynton Beach FL
John P. Cheraso - Boynton Beach FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 2600

US Classification:

21912163

Abstract:

A method for solder deposition by the use of a laser (24), comprises the steps of applying a predetermined thickness of solder (6) to a substrate (2) including over a printed circuitry pattern (4) on the substrate, laser printing (24) to a reflow temperature the solder on the printed circuitry pattern, leaving an un-reflowed portion (9) and then removing (26) the un-reflowed portion of the substrate, leaving solidified solder (7) on the printed circuitry pattern of the substrate. Additionally, if desired, a part (12) having solder pads (14) can be placed on the solder (7) after tack media (13) is placed on the solder. Then the part (12) and substrate can be reflowed in an oven (34).

US Patent:

53205618, Jun 14, 1994

Filed:

Jun 19, 1992

Appl. No.:

7/901341

Inventors:

Kenneth E. Cook - Lake Worth FL
Arthur L. A. Baker - Green Acres FL
Kenneth R. Warren - Lake Worth FL
Paul M. Bricketto - Boynton Beach FL
Allen D. Hertz - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04B 108

US Classification:

439500

Abstract:

A connector (40) for insertion into a portable electronic device (30) provides testing, programming and power thereto. The portable electronic device (30) has a chassis (32) housed therein and further includes a battery cavity (35) with battery contacts (36) therein. The connector (40) has a distal end for contacting the chassis (32) through an access port (34) in the battery cavity (35). A proximal end of the connector (40) is adapted for connection to a cable. The connector (40) has a substrate (50) attached to a printed wire board (41), wherein the printed wire board (41) further comprises a first plurality of conductors (52) thereon for receiving data signals from the cable, and a second plurality of conductors (42) thereon for receiving power signals from the cable. A first plurality of contacts (48) are coupled to the first plurality of conductors (52) at the distal end of the connector (40) for contacting the chassis, and a second plurality of contacts (46) are coupled to the second plurality of conductors (42) at the distal end of the connector (40) for contacting the battery contacts.

US Patent:

55070388, Apr 9, 1996

Filed:

Nov 14, 1994

Appl. No.:

8/338973

Inventors:

Kenneth E. Cook - Lake Worth FL
Jonathan Carr - Boynton Beach FL
John P. Cheraso - Boynton Beach FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04B 108

US Classification:

455351

Abstract:

A heat seal connector (100) includes a flexible substrate (105), interconnects (110) disposed thereon, and a parting agent (115) contiguous with the flexible substrate (105) for preventing the heat seal connector (100) from adhering to a heating platen (505) applied thereto, wherein the heating platen (505) does not include a parting agent for preventing the heat seal connector (100) from adhering to the healing platen (505). The heat seal connector (100) is bonded to first and second electronic circuits (415, 420) during application of the heating platen (505) such that the interconnects (110) electrically couple conductive pads (417) formed on the first electronic circuit (415) to corresponding conductive pads (425) formed on the second electronic circuit (420).