Kenneth R Devries

US Patent:

53288688, Jul 12, 1994

Filed:

Dec 10, 1992

Appl. No.:

7/989742

Inventors:

Richard A. Conti - Mount Kisco NY
Kenneth DeVries - Hopewell Junction NY
James F. White - Newburgh NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 2144
H01L 2148

US Classification:

437203

Abstract:

A metal connection for an integrated circuit device is effectively "cast" in place at any level of an integrated circuit. The "mold" for the connection is formed by depositing and patterning a sacrificial material, such as aluminum oxide or other metal oxides, and covering the sacrificial material with a protective material such as silicon dioxide or other insulators. After forming bore holes to the deposit of sacrificial material through the protective layer, the sacrificial material is removed by isotropic etching to form a cavity beneath and at least partially overlaid by the protective layer. Alternatively, a defect may be produced below the protective layer and filled with metal either with or without enlargement by further removal of material. This cavity is then filled with metal by deposition of the metal by, for instance, evaporation, sputtering and chemical vapor deposition or combinations thereof. Connections formed by this technique can be produced at any level of the integrated circuit and do not interfere with surface wiring.