David L. Addie - Chandler AZ Kenneth A. Ellsworth - Gilbert AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2348 H01L 2934 H01L 2948
US Classification:
357 67
Abstract:
An axial lead semiconductor device package is provided for use with non-planar semiconductor die. By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die to planar mounting surfaces is achieved.
Jackling Elementary School West Valley UT 1983-1986, Ft. Hamilton Public School 104 Brooklyn NY 1986-1989, Ward Middle School Bolingbrook IL 1989-1990, Jane Addams Middle School Bolingbrook IL 1990-1992