Kenneth P Kendall

US Patent:

56539070, Aug 5, 1997

Filed:

Feb 15, 1996

Appl. No.:

8/601812

Inventors:

Kenneth Neil Kendall - Dearborn MI
Alan Robert Harrison - Benfleet, GB2

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B29C 3342

US Classification:

249 79

Abstract:

A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.

US Patent:

52662594, Nov 30, 1993

Filed:

Sep 17, 1992

Appl. No.:

7/947008

Inventors:

Alan R. Harrison - Benfleet, GB2
Kenneth Kendall - Dearborn MI

Assignee:

Ford Motor Company - Dearborn MI

International Classification:

B29C 4573
B29C 6714

US Classification:

264257

Abstract:

In order to mold structural components where a resin is introduced into a mold containing a fibrous preform 24, the mold or tool halves 10, 12 are made as shells and have individually controllable heating circuits 34, 38, 52 around the mold surface. Different parts of the mold can therefore be held at different temperatures in order to ensure adequate resin flow to wet the whole of the preform.