Kenneth Boyd Lowery

US Patent:

54725925, Dec 5, 1995

Filed:

Jul 19, 1994

Appl. No.:

8/276965

Inventors:

Kenneth J. Lowery - San Dimas CA

Assignee:

American Plating Systems - Ontario CA

International Classification:

C25D 504
C25D 1700
C25D 1706

US Classification:

205137

Abstract:

An apparatus (10) for electrolytic plating of a substrate (44) includes a tank (14) in which a shaft (30) is centrally mounted for rotation about a first axis (28). The shaft carries an arm (40), on the distal end (112) of which is rotatably mounted a fixture wheel (44). The substrate to be plated is carried on the fixture wheel, which rides on an annular track (50) formed on the bottom of the tank around the shaft. A plurality of spaced pins (52) projecting upwardly from the track engage with a plurality of spaced recesses (56) formed about the perimeter (54) of the wheel, so that the wheel rotates about a second axis (64) while revolving around the first axis. The fixture carries a plurality of electrical contact members (46) that contact the substrate. Each contact member is separately supplied with current from a multichannel power supply (22). For each electrical contact member, the fixture includes a separate corresponding conductive brush (162), bushing (142) and lead (48) threaded through the arm and shaft to the corresponding channel of the power supply.

US Patent:

56700342, Sep 23, 1997

Filed:

Jun 17, 1996

Appl. No.:

8/664362

Inventors:

Kenneth J. Lowery - San Dimas CA

Assignee:

American Plating Systems - Ontario CA

International Classification:

C25D 504
C25D 1700

US Classification:

205143

Abstract:

A plating system (10) for plating a substrate such as a semiconductor wafer (116) in an electrolytic tank (12). A fixture wheel (14) is mounted within the electrolytic tank to rotate about a first axis (140). The fixture wheel receives the semiconductor wafer and supplies electrical current to the perimeter edge of the wafer. A fixture wheel drive motor (90) drives rotation of the fixture wheel about the first axis. An anode assembly (18) is mounted in the tank spaced from and facing towards the fixture wheel and received semiconductor wafer. The anode assembly carries first and second anodes (72) which are supplied with electrical current. A second motor (142) causes reciprocation of the anode assembly transversely in front of the rotating fixture wheel for improved uniformity in plating thickness and composition.