Kenneth Allen Thompson

US Patent:

51723034, Dec 15, 1992

Filed:

Nov 23, 1990

Appl. No.:

7/617323

Inventors:

Lonnie L. Bernardoni - Coral Springs FL
James A. Zollo - Coral Springs FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 700

US Classification:

361396

Abstract:

A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112 respectively. The two carriers 102, and 114, are electrically interconnected by the use of solder balls 106. Electronic component carrier 114 is in turn attached to an external printed circuit board by the use of solder balls 110. Optionally, each of the electronic components 108, 112 can be encapsulated using encapsulation material prior to the joining of the two carriers 102, and 114. In an alternate embodiment recesses 302 are located on top of the elevated peripheral edge 116 allowing for the proper alignment of the two carriers 102, and 114.

US Patent:

55571425, Sep 17, 1996

Filed:

Feb 4, 1991

Appl. No.:

7/650326

Inventors:

Peter B. Gilmore - Plantation FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 23552
H01L 2302

US Classification:

257659

Abstract:

A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

US Patent:

52626741, Nov 16, 1993

Filed:

Apr 9, 1992

Appl. No.:

7/866951

Inventors:

Kingshuk Banerji - Plantation FL
Kenneth R. Thompson - Sunrise FL
Francisco D. Alves - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302
H01L 3902

US Classification:

257712

Abstract:

Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.

US Patent:

51767732, Jan 5, 1993

Filed:

Jul 9, 1990

Appl. No.:

7/549841

Inventors:

Kenneth R. Thompson - Sunrise FL
Anthony B. Suppelsa - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

C04B 3700
B32B 3126

US Classification:

156 89

Abstract:

A method of manufacturing a ceramic substrate with improved mounting pad location tolerances. The method begins with a green non-dimensionally stable ceramic base 10 to which at least one conductive layer 15, 16 such as a tungsten mixture is screen printed. The tungsten layer locationally defines a pattern including pads 15. This composite assembly is subsequently stabilized as in firing and a second insulating ceramic slurry layer with openings 29 located over the relative larger pads is screen printed on the stabilized composite assembly. This method eliminates tolerances in final mounting pad location due to unpredictable shrinkage and yet maintains excellent mounting pad adhesion since the entire pad overlays some portion of the tungsten pad.

US Patent:

52182347, Jun 8, 1993

Filed:

Dec 23, 1991

Appl. No.:

7/811841

Inventors:

Kenneth R. Thompson - Sunrise FL
Kingshuk Banerj - Plantation FL
Francisco da Costa Alves - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2328
H01L 2348
H01L 2946
H01L 2302

US Classification:

257787

Abstract:

A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.

US Patent:

53813073, Jan 10, 1995

Filed:

Sep 29, 1993

Appl. No.:

8/129010

Inventors:

Allen D. Hertz - Boca Raton FL
David A. Tribbey - Boynton Beach FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 710
H05K 702

US Classification:

361767

Abstract:

A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518).

US Patent:

51728524, Dec 22, 1992

Filed:

May 1, 1992

Appl. No.:

7/877003

Inventors:

Lonnie L. Bernardoni - Boca Raton FL
Kenneth R. Thompson - Sunrise FL
Anthony B. Suppelsa - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

2281802

Abstract:

An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of the solder pads.

US Patent:

50110667, Apr 30, 1991

Filed:

Jul 27, 1990

Appl. No.:

7/558939

Inventors:

Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 3102
H05K 334

US Classification:

2281802

Abstract:

A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.

Address:

8891 1 Lady Ave, Las Vegas, NV 89148

VIN:

1HD1JB5197Y037055

Make:

Cadillac

Model:

Escalade ESV AWD 4dr

Year:

2007