Kenneth Carl Thompson

US Patent:

6353896, Mar 5, 2002

Filed:

Dec 15, 1998

Appl. No.:

09/211967

Inventors:

Gerard Johan Holzmann - Murray Hill NJ
Kenneth Lane Thompson - Watchung NJ
Philip Steven Winterbottom - Watchung NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

G06F 1136

US Classification:

714 38, 717 1

Abstract:

A technique for testing event driven software. In accordance with the technique, the source code of the event driven software is directly converted to an automation based model useful in verifying that the program code complies with the desired properties defined by the user. More particularly, the event driven system program code is translated into a target language for a particular model checker. Such a translation results in a model which contains statements directed at whether execution of the program code will affect the behavior of the event driven system. Thus, this model extraction process can be used as input to a logic model checker for determining whether event driven system complies with the desired correctness properties specified by the user. Advantageously, the model extraction process and application of the model checker occurs in a direct and dynamic fashion from the subject event driven system program code without the need for user intervention.

US Patent:

51723034, Dec 15, 1992

Filed:

Nov 23, 1990

Appl. No.:

7/617323

Inventors:

Lonnie L. Bernardoni - Coral Springs FL
James A. Zollo - Coral Springs FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 700

US Classification:

361396

Abstract:

A stackable surface mount electronic component assembly 100 allowing for the stacking of electronic components 108, and 112 is disclosed. The stackable surface mount electronic component assembly 100 includes electronic component carriers 102, and 114, each having an electronic component 108, and 112 respectively. The two carriers 102, and 114, are electrically interconnected by the use of solder balls 106. Electronic component carrier 114 is in turn attached to an external printed circuit board by the use of solder balls 110. Optionally, each of the electronic components 108, 112 can be encapsulated using encapsulation material prior to the joining of the two carriers 102, and 114. In an alternate embodiment recesses 302 are located on top of the elevated peripheral edge 116 allowing for the proper alignment of the two carriers 102, and 114.

US Patent:

54577969, Oct 10, 1995

Filed:

Jun 10, 1994

Appl. No.:

8/259262

Inventors:

Kenneth L. Thompson - Watchung NJ

Assignee:

AT&T IPM Corp. - Coral Gables FL

International Classification:

G06F 1730

US Classification:

395600

Abstract:

A file system which has component file systems including a primary file system which is react/write and a number of dump file systems which are read only. Each dump file system is created from the primary file system by means of a dump operation and conserves the state of the primary file system at the time the dump operation was performed. Component file systems share read only storage elements with older component file systems. The file system is implemented on a system including a file server, a magnetic disk mass storage device, and an optical write once-read many (WORM) disk. The magnetic disk mass storage device contains the read/write storage elements of the primary file system and encached read only storage elements from the WORM disk. Space is reserved on the unwritten portion of the WORM disk for the read-write storage elements of the primary file system. Techniques for performing file operations including opening, reading, writing, creating, and deleting files are disclosed, as well as techniques for performing the operations of dumping and restoring the primary file system.

US Patent:

55571425, Sep 17, 1996

Filed:

Feb 4, 1991

Appl. No.:

7/650326

Inventors:

Peter B. Gilmore - Plantation FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 23552
H01L 2302

US Classification:

257659

Abstract:

A shielded semiconductor package and a method for manufacturing the package is provided. The shielded semiconductor package comprises a metal coating (19) applied over an encapsulated semiconductor device (16). The device may be transfer molded or encapsulated by glob top technology. The metal coating (19) serves as a barrier to the transmission of electromagnetic or radio frequency energy, thereby shielding the semiconductor device (16). The shielded semiconductor package is manufactured by providing a metallization pattern (12 and 14) on a substrate (10) and mechanically attaching and electrically interconnecting a semiconductor device (16) to the metallization pattern. A resin (18) is transfer molded about the semiconductor device, the electrical interconnections (17), and the metallization pattern so as to form an assembly, and a metal coating (19) is applied via vacuum deposition or plating to interconnect with a portion of the metallization pattern.

US Patent:

56236662, Apr 22, 1997

Filed:

May 18, 1995

Appl. No.:

8/443650

Inventors:

Robert C. Pike - Basking Ridge NJ
Kenneth L. Thompson - Watchung NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

G06F 944

US Classification:

395616

Abstract:

An operating system which is particularly adapted to heterogenous distributed systems. Entities available to a process running in the operating system are provided by services. Each service models its entity as a set of files. The entity is controlled by performing operations on the set of files provided by the entity. Services other than those provided by the operating system all employ the same protocol specifying operations on files. The only requirement placed on a service by the operating system is that it be able to accept and respond to messages employing the protocol. The files are named, and the operating system provides a plurality of name spaces, relates each process to one of the name spaces, and permits any process to modify its name space or to create a new name space. Services are disclosed which provide each process using the service with its own set of the service's files and which provide files belonging to one process's namespace to another process executing on a different processor.

US Patent:

52626741, Nov 16, 1993

Filed:

Apr 9, 1992

Appl. No.:

7/866951

Inventors:

Kingshuk Banerji - Plantation FL
Kenneth R. Thompson - Sunrise FL
Francisco D. Alves - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2302
H01L 3902

US Classification:

257712

Abstract:

Epoxy bonding between an IC chip and a chip carrier is strengthened by creating substantially rougher oxidized surfaces within substantially smooth gold surfaces of a die paddle portion of the chip carrier.

US Patent:

51767732, Jan 5, 1993

Filed:

Jul 9, 1990

Appl. No.:

7/549841

Inventors:

Kenneth R. Thompson - Sunrise FL
Anthony B. Suppelsa - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

C04B 3700
B32B 3126

US Classification:

156 89

Abstract:

A method of manufacturing a ceramic substrate with improved mounting pad location tolerances. The method begins with a green non-dimensionally stable ceramic base 10 to which at least one conductive layer 15, 16 such as a tungsten mixture is screen printed. The tungsten layer locationally defines a pattern including pads 15. This composite assembly is subsequently stabilized as in firing and a second insulating ceramic slurry layer with openings 29 located over the relative larger pads is screen printed on the stabilized composite assembly. This method eliminates tolerances in final mounting pad location due to unpredictable shrinkage and yet maintains excellent mounting pad adhesion since the entire pad overlays some portion of the tungsten pad.

US Patent:

52182347, Jun 8, 1993

Filed:

Dec 23, 1991

Appl. No.:

7/811841

Inventors:

Kenneth R. Thompson - Sunrise FL
Kingshuk Banerj - Plantation FL
Francisco da Costa Alves - Boca Raton FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2328
H01L 2348
H01L 2946
H01L 2302

US Classification:

257787

Abstract:

A semiconductor device assembly comprises a semiconductor device (10) attached to a substrate (20). The substrate has a metallization pattern (22) on the surface and a polymeric film (24) covering most of the surface and the metallization pattern. A window-frame shaped opening (26) is created in the film, exposing portions of the substrate surface. The semiconductor device is attached to the substrate in such a manner that it lies in the interior perimeter (28) of the window-frame shaped opening in the film. An adhesive material (18) is applied to fill the space between the semiconductor device and the substrate. The window frame opening in the polymeric film serves to confine the adhesive to the area in the opening and underneath the device and prevents unwanted spread of the underfill material by forming an ideal fillet geometry. In another embodiment of the invention, the semiconductor device is in a package and the package is attached directly to the substrate.