Kenneth C Thompson

US Patent:

6979149, Dec 27, 2005

Filed:

Jun 16, 2004

Appl. No.:

10/869424

Inventors:

Kenneth R. Thompson - Chuluota FL, US

International Classification:

E02C005/00

US Classification:

405 86, 405 85, 405 3

Abstract:

A system for transferring a vessel between a first body of water having a first water level and a second body of water having a second water level includes a barrier separating the first body of water from the second body of water. The system also includes a transfer structure adjacent the barrier for receiving the vessel to be transferred between the first and second bodies of water, and a transfer apparatus adjacent the barrier for moving the transfer structure between a first position and a second position. The upper portion of the barrier includes a barrier door that is movable between an opened position when the transfer structure is in the second position to allow the vessel to move into and out of the transfer structure, and a closed position when the transfer structure is in the first position.

US Patent:

7722454, May 25, 2010

Filed:

Apr 27, 2005

Appl. No.:

11/115803

Inventors:

Kenneth R. Thompson - Chuluota FL, US
Debra R. Hatch - Port Orange FL, US

International Classification:

A63F 9/24

US Classification:

463 16, 463 1, 340933, 340928

Abstract:

A system for generating revenue includes a fee collection station. The fee collection station may include a controller and a fee receiver in communication with the controller for receiving a predetermined fee from a plurality of users. The fee receiver may also receive a predetermined participation fee from the plurality of users that selectively participate in a game. The fee collection station may also comprise an indicator in communication with the controller and adjacent to the fee receiver for indicating to participating users one of a winning indication or a losing indication. The participating users that receive the winning indication may receive a predetermined reward.

US Patent:

53813073, Jan 10, 1995

Filed:

Sep 29, 1993

Appl. No.:

8/129010

Inventors:

Allen D. Hertz - Boca Raton FL
David A. Tribbey - Boynton Beach FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 710
H05K 702

US Classification:

361767

Abstract:

A mounting pad arrangement (FIG. 5) improves reliability of placement of a surface mount component. A first pad array is disposed throughout an area on the surface (308) of a substrate (202), the area having four outside corners. The first pad array includes contact pads (502) arranged in a first linear grid pattern, and eight aligning pads (504,506,510,514,518), larger than the contact pads (502). Two aligning pads (504,506,510,514,518) are near each of the four outside corners. Each aligning pad (504,506,510,514,518) is positioned off center with respect to the first linear grid pattern such that a tangential line (608,610,612,614) can be drawn between an innermost point of the aligning pad (504,506,510,514,518) and corresponding innermost points of the contact pads (502) that are collinear on the first linear grid pattern. A second pad array (406) is disposed on the surface mount component and arranged in a second linear grid pattern that aligns with the first linear grid pattern. Eight pads of the second pad array (406) also align with points of intersection of the first linear grid pattern that fall within each of the eight aligning pads (504,506,510,514,518).

US Patent:

51728524, Dec 22, 1992

Filed:

May 1, 1992

Appl. No.:

7/877003

Inventors:

Lonnie L. Bernardoni - Boca Raton FL
Kenneth R. Thompson - Sunrise FL
Anthony B. Suppelsa - Coral Springs FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H05K 334

US Classification:

2281802

Abstract:

An electronic component (14) is soldered to a circuit carrying substrate (11) by a method that allows the component to remain in better contact with the flat solder pads of the substrate. The circuit carrying substrate (11) has a plurality of solder pads (12) disposed thereon, each pad consisting of a terminal portion (16), a solder reservoir portion (18), and a bridging portion (17). The terminal portion is connected to the reservoir portion by the bridging portion. The bridging portion is typically a necked down portion of the pad. The electronic component (14) has a plurality of solderable terminals (15) corresponding to the terminal portions (16) of the solder pads (12). Each of the solder pad reservoir portions are coated with a reservoir of solder (23). The amount of solder coated onto the reservoir portion is sufficient to provide a fillet between the component (14) and the solder pad terminal portion (16) during a subsequent heating step. A flux (25) is then applied to the solder pad terminal portions (16), and the electronic component (14) is placed on the circuit carrying substrate so that each of component terminals is in the flux and contacts the terminal portions of the solder pads.

US Patent:

52558398, Oct 26, 1993

Filed:

Jan 2, 1992

Appl. No.:

7/816684

Inventors:

Francisco da Costa Alves - Boca Raton FL
Anthony B. Suppelsa - Coral Springs FL
Kenneth R. Thompson - Sunrise FL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

B23K 3102

US Classification:

22818021

Abstract:

A method for applying solder on a substrate (12) comprises the steps of providing a substrate (12) having predefined solder pads (15) and then providing solder spheres (16) for suitable placement on the solder pads. Then applying flux (14) and tacking media (18) between the solder pads (15) and the solder spheres (16) and then placing the solder spheres on the solder pads. Subsequently the solder spheres are heated onto the solder pads of the substrate providing reflowed solder (26) on the solder pads. Then a layer of flux tacking media (28) is applied on the reflowed solder. Next, a component (30 or 40) is placed on the reflowed solder and flux tacking media providing a substrate assembly (10). Finally, the circuit assembly is heated allowing the component to be soldered to the solder pad.

US Patent:

20170167138, Jun 15, 2017

Filed:

Feb 13, 2017

Appl. No.:

15/430848

Inventors:

Kenneth R. Thompson - Chuluota FL, US

International Classification:

E04C 3/29
E04C 3/36
E04C 3/02

Abstract:

A structural component for use in building construction including a first support material member, a second support material member, an insulating material, and a first securing member. The first support material member may have a first length and a first edge. The second support material member may have a second length and a second edge and may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to contact the first edge and the second edge.

US Patent:

20160356044, Dec 8, 2016

Filed:

Jun 1, 2016

Appl. No.:

15/169982

Inventors:

Kenneth R. Thompson - Chuluota FL, US

International Classification:

E04C 3/12
E04B 1/76
E04B 1/88

Abstract:

A structural component for use in building construction including a first and second support material member, an insulating material, and a first securing member. The first support material member may have a first length, a first side, and an opposing second side. The second support material member may have a second length, a first side, and an opposing second side. The second support material member may oppose the first support material member. The insulating material may be disposed between the first support material member and the second support material member. The first securing member may be adapted to secure the first support material member to the second support material member.