Kenneth E Thomson

US Patent:

20120104359, May 3, 2012

Filed:

Nov 8, 2011

Appl. No.:

13/291922

Inventors:

Andrew Felker - Livermore CA, US
Nicholas A. Vickers - Hayward CA, US
Rafael Aldaz - Pleasanton CA, US
David Press - San Francisco CA, US
Nicholas J. Pfister - Goleta CA, US
James W. Raring - Goleta CA, US
Mathew C. Schmidt - Goleta CA, US
Kenneth John Thomson - San Francisco CA, US

Assignee:

Soraa, Inc. - Fremont CA

International Classification:

H01L 33/06
H01L 33/32

US Classification:

257 14, 438 33, 257E33008, 257E33025

Abstract:

A method for forming optical devices includes providing a gallium nitride substrate having a crystalline surface region and a backside region. The backside is subjected to a laser scribing process to form scribe regions. Metal contacts overly the scribe regions.

US Patent:

20150357513, Dec 10, 2015

Filed:

Aug 17, 2015

Appl. No.:

14/827709

Inventors:

- FREMONT CA, US
KENNETH JOHN THOMSON - FREMONT CA, US

International Classification:

H01L 33/00
H01L 33/22
H01L 33/38

Abstract:

A method for fabricating LED devices. The method includes providing a gallium and nitrogen containing substrate member (e.g., GaN) comprising a backside surface and a front side surface. The method includes subjecting the backside surface to a polishing process, causing a backside surface to be characterized by a surface roughness, subjecting the backside surface to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, treating the backside surface comprising the plurality of pyramid-like structures, to a plasma species, and subjecting the backside surface to a surface treatment. The method further includes forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material.

US Patent:

20150171276, Jun 18, 2015

Filed:

Feb 23, 2015

Appl. No.:

14/629049

Inventors:

- Fremont CA, US
Kenneth Jonh Thomson - Fremont CA, US

International Classification:

H01L 33/40
H01L 33/00

Abstract:

A method for fabricating LED devices. The method includes providing a gallium and nitrogen containing substrate member (e.g., GaN) comprising a backside surface and a front side surface. The method includes subjecting the backside surface to a polishing process, causing a backside surface to be characterized by a surface roughness, subjecting the backside surface to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, treating the backside surface comprising the plurality of pyramid-like structures, to a plasma species, and subjecting the backside surface to a surface treatment. The method further includes forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material.

US Patent:

20150014695, Jan 15, 2015

Filed:

Jul 9, 2013

Appl. No.:

13/937338

Inventors:

- Fremont CA, US
KENNETH JOHN THOMSON - FREMONT CA, US

International Classification:

H01L 33/32
H01L 33/22

US Classification:

257 76, 438 34

Abstract:

A method for fabricating LED devices. The method includes providing a gallium and nitrogen containing substrate member (e.g., GaN) comprising a backside surface and a front side surface. The method includes subjecting the backside surface to a polishing process, causing a backside surface to be characterized by a surface roughness, subjecting the backside surface to an anisotropic etching process exposing various crystal planes to form a plurality of pyramid-like structures distributed spatially in a non-periodic manner on the backside surface, treating the backside surface comprising the plurality of pyramid-like structures, to a plasma species, and subjecting the backside surface to a surface treatment. The method further includes forming a contact material comprising an aluminum bearing species or a titanium bearing species overlying the surface-treated backside to form a plurality of LED devices with the contact material.